Reliability test system for laser chip

Abstract

The invention discloses a reliability test system for a laser chip. The system comprises a substrate, a carrier plate, and a first PCB, wherein the carrier plate is provided with a chip groove, the first PCB is provided with a chip probe, a TEC is disposed between the substrate and the carrier plate, a thermal insulation plate is disposed between the substrate and the first PCB, and a thermal insulation through groove is disposed in the thermal insulation plate; a second PCB is provided with a connection contact, a test contact, a welding contact and a power supply contact; the first PCB and abase plate are installed on the substrate through a fixing screw; the substrate is also provided with a limiting rod; the limiting rod is sleeved with a limiting spring; the base plate is provided with a limiting hole allowing a limiting rod to be embedded therein; the portion, on one side of the limiting hole, of the base plate is also provided with a strip-shaped guide hole in a communicating mode, and the strip-shaped guide hole is located in the side, close to the chip, of the base plate; the welding contact is located on the bottom surface of the second PCB; and a welding through hole corresponding to the welding contact is formed in the bottom surface of the substrate. According to the invention, temperature control precision can be improved; and a plurality of chips can be tested at a time, so test efficiency is effectively improved.

Description

technical field [0001] The invention relates to a reliability testing system for laser chips, which belongs to the technical field of chip processing. Background technique [0002] Chip burn-in testing is an electrical stress testing method that uses voltage and high temperature to accelerate the electrical failure of a device, in which the burn-in process basically simulates running the entire life of the chip because the electrical stimulus applied during the burn-in process reflects the worst-case operation of the chip . [0003] The burn-in test can be used as a device reliability test or as a production window to find early failures of the device. Generally, the device used for chip burn-in test is to work together with the external circuit board through the test socket. In the existing burn-in test fixture, The heating source that provides the temperature is far away from the chip, the temperature control accuracy is poor, and only a single chip can be tested at a tim...

AI Technical Summary

Problems solved by technology

[0003] The burn-in test can be used as a device reliability test or as a production window to find early failures of the device. Generally, the device used for chip burn-in test is to work together with the external circuit board through the test socket. In the existing burn-in test fixture, The heating source that provides the temperature is far away from the chip, the temperature control accuracy is poor, and only a single chip can be tested at a time, which is very troublesome

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