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Photosensitive layer, laminate, photosensitive resin composition, and kit

A technology of photosensitive resin and photosensitive layer, which is applied in the field of photosensitive layer, laminated body, photosensitive resin composition and kit, and can solve problems such as the vulnerability of organic semiconductors and the limitation of pattern microfabrication

Pending Publication Date: 2020-10-23
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a limit to the microfabrication of patterns formed by printing technology
Moreover, organic semiconductors also have the problem of being easily damaged

Method used

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  • Photosensitive layer, laminate, photosensitive resin composition, and kit
  • Photosensitive layer, laminate, photosensitive resin composition, and kit
  • Photosensitive layer, laminate, photosensitive resin composition, and kit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～ Embodiment 11 and comparative example 1～ comparative example 3

[0357]

[0358] After mixing each component by the following formula to prepare a uniform solution, it filtered using the nylon filter which has a pore size of 0.8 micrometers, and the water-soluble resin composition was prepared.

[0359] >

[0360] 15.0 parts by mass of the following PVA

[0361] Surfactant D-1 (below) 0.008 parts by mass

[0362] Water 84.9 parts by mass

[0363] PVA (manufactured by KURARAY CO., LTD. PVA-203 degree of saponification 88.0% degree of polymerization 300)

[0364] >

[0365] The following PVP 7.9 parts by mass

[0366] Surfactant D-1 (below) 0.008 parts by mass

[0367] Water 92.1 parts by mass

[0368] PVP (Mw=360,000 Tokyo Chemical Industry Co., Ltd. polyvinylpyrrolidone K90)

[0369]

[0370] >

[0371] After mixing each component by the following formula to prepare a uniform solution, it filtered using the polypropylene filter which has a pore size of 0.6 micrometers, and the water-insoluble resin composition was prepared.

[...

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Abstract

Provided are a photosensitive layer, a laminate, a photosensitive resin composition, and a kit. The photosensitive layer is included in a laminate having a water-soluble resin layer and the photosensitive layer, and is formed from a photosensitive resin composition containing: a compound capable of generating an acid upon irradiation with actinic rays or radiation; and a resin of which the dissolution rate in butyl acetate varies according to the action of an acid. The resin of which the dissolution rate in butyl acetate varies according to the action of an acid has a weight average molecularweight of 10,000-50,000, and is a hydrophobic resin which is soluble in butyl acetate at 23 DEG and in which 50-100 mol% of units soluble in an aqueous alkali solution among the total constituent units are protected by a hydrophobic protection group. The dissolution rate of the unirradiated photosensitive layer when immersed in butyl acetate at 23 DEG is 20-200 nm / s. The static contact angle of the photosensitive resin composition on the water-soluble resin layer is 60 DEG or less.

Description

technical field [0001] The present invention relates to a photosensitive layer, a laminate, a photosensitive resin composition, and a kit. Background technique [0002] In recent years, electronic devices using organic semiconductors have been widely used. Compared with conventional devices using inorganic semiconductors such as silicon, devices using organic semiconductors have the advantage of being able to be manufactured through simple steps. Furthermore, organic semiconductors can easily change material properties by changing their molecular structure. In addition, there are abundant variations in materials, and it is considered that functions and elements that cannot be realized by inorganic semiconductors can be realized. Organic semiconductors are suitable for use in electronic devices such as organic solar cells, organic electroluminescent displays, organic photodetectors, organic field effect transistors, organic electroluminescent elements, gas sensors, organic ...

Claims

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Application Information

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IPC IPC(8): G03F7/038C08F20/28C08F212/14G03F7/039G03F7/11
CPCC08F20/28G03F7/039G03F7/038G03F7/11C08F212/22G03F7/004G03F7/2004
Inventor 增田诚也
Owner FUJIFILM CORP