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Heat exchanging arrangement and subsea electronic system

A technology of heat exchange device and electronic system, which is applied in the direction of heat exchange equipment, heat exchanger fixing, electrical equipment shell/cabinet/drawer, etc. Heat transfer and other issues, to achieve the effect of reduced heat transfer performance, small and light design, and excellent heat transfer performance

Pending Publication Date: 2020-10-27
ABB (SCHWEIZ) AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in many embodiments, housing walls that include corrugations do not provide sufficient heat dissipation
Therefore, the relatively low heat transfer from the dielectric fluid, through the enclosure wall, and to the surrounding seawater limits the thermal performance of subsea electronic systems
Therefore, low heat transfer through the enclosure walls is a bottleneck in many types of subsea electronic systems

Method used

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  • Heat exchanging arrangement and subsea electronic system
  • Heat exchanging arrangement and subsea electronic system
  • Heat exchanging arrangement and subsea electronic system

Examples

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Embodiment Construction

[0053] Hereinafter, a heat exchange device for a subsea electronic system and a subsea electronic system including the heat exchange device will be described. The same reference numerals will be used to denote the same or similar structural features.

[0054] figure 1 A side view of an example of a subsea electronic system 10 submerged in seawater 12 is schematically represented. The subsea electronics system 10 includes a watertight enclosure 14 , electronics 16 and a plurality of heat exchange devices 18 . Housing 14 includes four vertical side wall segments 20 , a horizontal top wall segment 22 and a bottom 24 . Each wall segment 20 , 22 includes corrugations 26 forming part of the heat exchange device 18 . The corrugations 26 in the top wall section 22 are horizontal and the corrugations 26 in the side wall section 20 are vertical. In this example, a heat exchange device 18 is arranged in each side wall segment 20 and top wall segment 22 . Each wall section 20, 22 is ...

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PUM

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Abstract

The invention generally relates to a heat exchanging arrangement and a subsea electronic system. A heat exchanging arrangement (18) for a subsea electronic system (10), the heat exchanging arrangement(18) comprising a wall section (20, 22); a corrugation (26) formed in the wall section (20, 22), the corrugation (26) having two generally opposing internal corrugation surfaces (44); and at least one heat exchanging element (36) forced against at least one of the internal corrugation surfaces (44). A subsea electronic system (10) comprising a heat exchanging arrangement (18) is also provided.

Description

technical field [0001] The present disclosure generally relates to heat exchange devices. Specifically, a heat exchange device for a subsea electronic system and a subsea electronic system including the heat exchange device are provided. Background technique [0002] Electronic equipment for subsea electrification may advantageously be submerged in a tank or enclosure containing a dielectric fluid. Examples of such electronic devices are static induction devices, such as transformers, and power electronics, such as power converters, variable speed drives or HVDC (High Voltage Direct Current) valves. The enclosure, and the electronics within the enclosure, form a subsea electronics system. The dielectric fluid serves as the electrical insulation and heat dissipation medium and can be used with one or more pressure compensators to achieve an internal pressure close to or equal to the external pressure of the surrounding seawater. [0003] Cooling of electronic devices can b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20263H05K7/20927H05K7/20236H05K7/14337F28F3/06F28F9/26F28F2275/10H05K5/067H05K7/2039
Inventor T·拉内里德T·格拉丁格T·瓦格纳H·伦登曼
Owner ABB (SCHWEIZ) AG
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