Sand blasting equipment for large-length-to-diameter-ratio rotating pipe target material

Abstract

The invention discloses sand blasting equipment for a large-length-to-diameter-ratio rotating pipe target material. The sand blasting equipment comprises an I-shaped support and a foot support, wherein the I-shaped support comprises an upper pipe target fixing cover and a lower pipe target fixing cover, the middle of the rotating pipe target material is sleeved with a rubber jacket, the left sideand the right side of the upper pipe target fixing cover and the left side and the right side of the lower pipe target fixing cover each are provided with two positioning discs, the lower pipe targetfixing cover and the positioning discs are integrally designed, the movement of the positioning discs drives the movement of the lower pipe target fixing cover, so that the free rotation of the rotating pipe target material in the vertical direction is realized, the two ends of the rotating pipe target material each are provided with two sand blasting baffles, the sand blasting baffles located onthe end faces of the rotating pipe target material are provided with lifting lugs, and the foot support achieves lifting and carrying of the rotating pipe target material through cooperation of lifting ropes and the lifting lugs. According to the sand blasting equipment, the I-shaped support and the foot support are combined for pipe target sand blasting so that the pipe target material can freelyrotate in the vertical direction, accurate sand blasting is achieved, and the problems that large-length-to-diameter-ratio pipe target sand blasting occupied space is large, the sand blasting angle is limited and the like are solved.

Description

technical field [0001] The invention belongs to the field of sputtering technology, and in particular relates to a sand blasting device for a rotating tube target with a large length-to-diameter ratio. Background technique [0002] High-purity metal sputtering targets are one of the key supporting materials for the high-end integrated circuit industry. Sputtering targets are mainly divided into rotating targets and planar targets. Compared with the planar sputtering target, the sputtering coating of the rotating target has good continuity, the composition of the coating is uniform, and the utilization rate is about 2 times that of the planar sputtering target, especially after the 8.5 generation line, the large aspect ratio rotating target The material gradually replaces the planar target. Therefore, it is more advantageous to carry out the processing and manufacturing of rotating targets with large aspect ratio. [0003] The surface treatment process of the large aspect r...

AI Technical Summary

Problems solved by technology

However, due to the high weight and long length of the rotating tube target with a large aspect ratio, there are problems such as difficulty in handling large-size rotating tube targets, large floor space, and limited sandblasting direction angles during production line operations. Low operating efficiency

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