Laser module and laser device

A laser module and laser technology, applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve the problems of large-scale devices and increased manufacturing costs

Pending Publication Date: 2020-11-03
FUJIKURA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, since it is necessary to mount a plurality of temperature measuring elements, it leads to an increase in manufacturing cost and further enlargement of the device.

Method used

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  • Laser module and laser device
  • Laser module and laser device
  • Laser module and laser device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0017] figure 1 It is a partial plan cross-sectional view schematically showing the laser device 100 in the first embodiment of the present invention. Such as figure 1 As shown, the laser device 100 includes a laser module 1 , a processing unit 2 connected to the laser module 1 , and a monitor 3 connected to the processing unit 2 .

[0018] The laser module 1 of the laser device 100 outputs laser light from a plurality of laser elements to the outside, and detects a temperature change of the module through a thermistor. The processing unit 2 of the laser device 100 calculates the remaining lifetime of the laser module 1 based on the data from the thermistor. The monitor 3 of the laser device 100 displays the remaining life of the laser module 1 calculated by the processing unit 2 .

[0019] Such as figure 1 As shown, the laser module 1 is equipped with: a plurality of (five in this embodiment) laser elements 20, which emit laser light along the +Y direction; a plurality (f...

no. 2 approach

[0066] Next, the laser module 201 in the second embodiment of the present invention will be described. here, Figure 4 is a partial cross-sectional plan view schematically showing the laser module 201 . Such as Figure 4 As shown, the laser module 201 has an encapsulation case 210 . The packaging case 210 includes a bottom plate 211 and a frame body 212 fixed on the outer edge of the bottom plate 211 . The bottom plate 211 is formed in approximately half the size of the bottom plate 11 of the first embodiment, and has a base portion 214 and a stepped portion 213 . Five layers of mounting surfaces 215A to 215E are formed on the stepped portion 213 so as to gradually increase in height toward the −X direction, and the laser element 20 and the reflection mirror 41 are fixed to the mounting surfaces 215A to 215E, respectively. That is, the laser module 201 has only the first laser element group 23 unlike the laser module 1 in the first embodiment.

[0067] The laser light L1 ...

no. 3 approach

[0072] Next, the laser module 301 in the third embodiment of the present invention will be described. here, Figure 5 It is a partial plan cross-sectional view schematically showing the laser module 301 . Such as Figure 5 As shown, the laser module 301 has an encapsulation case 310 . The packaging case 310 includes a flat bottom plate 311 and a frame 312 fixed on the outer edge of the bottom plate 311 . Five laser elements 20 (that is, the above-mentioned first laser element group 23 ) are mounted on the bottom plate 311 via the base 21 . Further, five reflection mirrors 341 , a 1 / 2 wavelength plate 44 , a beam splitter 50 , and a condenser lens 70 are installed on the bottom plate 311 .

[0073] The five reflecting mirrors 341 are arranged to be displaced from each other at a predetermined pitch along the Y direction. In addition, the reflective mirror 341 located closest to the −X direction side is closest to the corresponding laser element, and the reflective mirror 3...

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Abstract

Provided is a laser module capable of accurately detecting a malfunction in the module with a small number of temperature measuring elements. The laser module 1 is equipped with semiconductor laser element groups 23, 33. Laser lights L1, L2 emitted from the semiconductor laser element groups 23, 33 include a TE mode (main polarization) and a TM mode (minor polarization). In addition, the laser module 1 comprises: a package casing 10; a beam splitter 50; and an optical fiber 60 optically coupled to, and outputting to the exterior, a multiplexed main polarization light L3 split by the beam splitter 50. Provided on the inner wall of the package casing 10 is a minor polarization irradiation region 17 that is irradiated by a multiplexed minor polarization light L4 split by the beam splitter 50.Mounted on the package casing 10 is a thermistor 90 detecting a change in the temperature of the minor polarization irradiation region 17.

Description

technical field [0001] The present invention relates to a laser module and a laser device, in particular to a laser module capable of detecting failures of the laser module. Background technique [0002] Conventionally, as such a laser module, there is known a laser module that detects a module defect by detecting a temperature change inside the module with a temperature measuring element (for example, a thermistor) (for example, refer to Patent Document 1). However, in the structure of the laser module of Patent Document 1, when the size of the module is increased by mounting a plurality of laser elements, etc., a portion (non-detection portion) exceeding the detection range of the temperature measuring element may sometimes occur, thereby Cannot accurately detect bad conditions. For example, in a laser module mounted with a plurality of laser elements, if a laser element in a non-inspection portion fails, the failure is not detected, and thus the cumulative number of fail...

Claims

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Application Information

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IPC IPC(8): H01S5/022H01S5/0239
CPCH01S5/4012H01S5/4031H01S5/02251H01S5/02325H01S5/06825H01S5/06804H01S5/02208H01S5/0021H01S5/0239H01S5/06236
Inventor 葛西洋平
Owner FUJIKURA LTD
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