Local large-area welding plate-level interconnection integration method for airtight packaging unit

A technology of hermetic packaging and integration method, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of low reliability of signal interconnection, improve the tensile and shear strength of pads, and improve reliability Sexuality, reduced peeling or tearing effect

Active Publication Date: 2020-11-13
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a local large-area soldered board-level interconnection integration method fo

Method used

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  • Local large-area welding plate-level interconnection integration method for airtight packaging unit
  • Local large-area welding plate-level interconnection integration method for airtight packaging unit
  • Local large-area welding plate-level interconnection integration method for airtight packaging unit

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Example Embodiment

[0046] The following describes the specific embodiments of the present invention to facilitate those skilled in the art to understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments, for those of ordinary skill in the art, as long as various changes These changes are obvious within the spirit and scope of the present invention defined and determined by the appended claims, and all inventions and creations using the concept of the present invention are protected.

[0047] Such as figure 1 As shown, a locally large-area welding board-level interconnection integration method of a hermetic package unit includes the following steps:

[0048] In this embodiment, tin-lead solder balls are used as interconnecting solder joints.

[0049] S1. Using HTCC process to make hermetic packaging substrate; Figure 2 ~ Figure 4 As shown, the HTCC hermetic package substrate 3 is fabricated by the co-firing process, and the...

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Abstract

The invention discloses a local large-area welding plate-level interconnection integration method for an airtight packaging unit, in particular to a local large-area welding plate level interconnection integration method for a bonding pad enhanced airtight packaging unit. Manufacturing of an enhanced bonding pad on a substrate is completed through an HTCC process; airtight packaging is realized through multi-temperature gradient welding of the packaging substrate, the composite enclosure frame and the cover plate; high-reliability plate-level interconnection of the airtight packaging unit andthe system mother board is completed through a tin-lead solder ball/solder column and composite enclosure frame structure combined welding method.

Description

technical field [0001] The invention relates to the technical field of board-level interconnection of electronic packaging, in particular to an integrated method for local large-area welding board-level interconnection of hermetic packaging units. Background technique [0002] Electronic complete machines put forward higher requirements for packaging miniaturization, high density, multi-functionality, high reliability, and high power. The system-level packaging form using co-fired multilayer ceramic substrates has been widely favored. The signal interconnection between the multilayer ceramic package and the system motherboard is usually implemented by a ball grid array (BGA) interconnection. However, the thermal expansion coefficients of multilayer ceramic substrates and system motherboards differ greatly. As the complexity of package functions increases and the size of package substrates increases, when experiencing high and low temperature loads, the bonding pads and inter...

Claims

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Application Information

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IPC IPC(8): H01L21/768H01L21/48
CPCH01L21/76895H01L21/4817
Inventor 王辉李阳阳庞婷董东卢茜曾策张继帆罗明张晏铭董乐李杨陆吟泉徐榕青向伟玮毛小红
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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