Semiconductor packaging structure and packaging method
A packaging structure and packaging method technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problem of large overall size of semiconductor packaging structures, and achieve the effect of reducing size and improving integration
Active Publication Date: 2020-11-13
LUXSHARE ELECTRONICS TECH (KUNSHAN) LTD
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Problems solved by technology
[0003] The existing electromagnetic shielding structure uses a metal cover, which leads to the overall size of the semiconductor packaging structure being too large, which is contradictory to the development trend of high integration and miniaturization of the semiconductor packaging structure
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[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0023] As mentioned in the background art above, in the existing semiconductor packaging structure, the size of the structure after packaging the shielding module is too large, which contradicts the development trend of high integration and miniaturization of semiconductors. The reason is that in the existing semiconductor packaging structure, a metal cover is usually used to cover the semiconductor packaging structure including the shielding module, so as to shield the interference of electromagnetic signals. The...
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The invention discloses a semiconductor packaging structure and packaging method, and the structure comprises: a circuit board which comprises at least one electromagnetic shielding region and a non-electromagnetic shielding region located at one side of the electromagnetic shielding region, wherein the interior of the circuit board comprises N metal circuit layers which are stacked in sequence, and insulating layers located between the adjacent metal circuit layers; a non-shielding module which is located in the non-electromagnetic shielding region, wherein the shielding module is located inthe electromagnetic shielding region; a thin film packaging layer which is located on the first surface side of the circuit board, wherein the thin film packaging layer covers the non-electromagneticshielding region and the electromagnetic shielding region; and an electromagnetic shielding structure which covers the electromagnetic shielding region and forms a closed space with the circuit board.According to the technical scheme provided by the embodiment of the invention, the size of the semiconductor packaging structure is reduced, and the integration level of the semiconductor packaging structure is improved.
Description
technical field [0001] Embodiments of the present invention relate to the technical field of semiconductors, and in particular, to a semiconductor packaging structure and a packaging method. Background technique [0002] In the electronic packaging process, with the trend of miniaturization of the package size, when the electronic devices in the semiconductor package structure are too close, signal crosstalk is prone to occur, especially for high-frequency analog chips, whose reliability is easily affected by external electromagnetic signals. interference. Therefore, for the packaging of some electronic devices, a corresponding electromagnetic shielding structure needs to be provided, and the electromagnetic shielding structure can eliminate adverse effects of electromagnetic interference on the electronic device. [0003] The existing electromagnetic shielding structure adopts a metal cover, which leads to the overall size of the semiconductor packaging structure being too...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L25/16H01L21/98H01L23/31H01L23/498H01L23/552H01L21/50H01L21/56
CPCH01L25/16H01L25/50H01L23/49838H01L23/3107H01L23/552H01L21/50H01L21/56H01L2224/48091H01L2224/48227H01L2924/181H01L23/66H01L2223/6677H01L25/0655H01L2224/73265H01L2224/48095H01L2224/49171H01L2224/05554H01L2924/00014H01L2224/16225H01L24/16H01L24/48H01L24/73H01L2924/1815H01L24/97H01L2224/32225H01L24/32H01L23/3121H01L21/561H01L2924/00012H01L2224/29099H01L2224/45099H01L23/5226H01Q1/2208
Inventor 周小磊刘鹏康文彬
Owner LUXSHARE ELECTRONICS TECH (KUNSHAN) LTD