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OLED panel packaging structure and manufacturing method thereof

A packaging structure and manufacturing method technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as low sealing ratio, water and oxygen penetration, poor packaging effect, etc., and achieve better airtightness Excellent, improve the life of OLED devices, and block the effect of water and oxygen intrusion

Inactive Publication Date: 2020-11-13
FUJIAN HUAJIACAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the commonly used packaging technology for mass production is glass glue packaging (that is, frit glue packaging). After the Frit glue is coated, due to the influence of gravity, its cross-section will form a saddle shape after a period of time, and the middle collapse will reduce the contact area between the glass glue and the OELD glass. Small and there are gaps in the middle, resulting in low sealing ratio, resulting in poor packaging effect, easy to cause water and oxygen infiltration and affect the life of OLED devices

Method used

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  • OLED panel packaging structure and manufacturing method thereof
  • OLED panel packaging structure and manufacturing method thereof

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Embodiment 1

[0044] Please refer to figure 1 , Embodiment 1 of the present invention is:

[0045] An OLED panel packaging structure, including a cover glass 1, on the surface of the cover glass 1, a transparent film layer 2, a frit glue layer 3 and a back glass 4 are sequentially stacked;

[0046] The shape of the vertical section of the transparent film layer 2 is convex, the frit adhesive layer 3 is wrapped on the surface of the transparent film layer 2 and the frit adhesive layer 3 is in contact with the cover glass 1 .

[0047] The transparent film layer 2 includes an upper convex film layer and a lower convex film layer, the upper convex film layer and the lower convex film layer are sequentially arranged on the surface of the cover glass 1, the upper convex film layer and the lower convex film layer The width ratio of the film layer in the vertical section is 1:2, and the width ratio of the lower convex film layer and the frit glue layer in the vertical section is 2:3.

[0048] The...

Embodiment 2

[0051] Please refer to figure 2 , the second embodiment of the present invention is:

[0052] A method for manufacturing an OLED panel packaging structure, comprising the following steps:

[0053] S1. A cover glass 1 is provided, and the surface of the cover glass 1 is covered with a transparent film layer 2; the shape of the vertical section of the transparent film layer 2 is convex; the transparent film layer 2 is a silicon nitride film layer;

[0054] S2, forming a frit glue layer 3, covering the surface of the transparent film layer 2 and in contact with the cover glass 1;

[0055] S3 , forming the back glass 4 and covering the surface of the frit glue layer 3 .

[0056] Step S1 is specifically:

[0057] A cover glass 1 is provided, and a transparent film layer 2 is formed by a chemical vapor deposition process and covers the surface of the cover glass 1 .

[0058]To sum up, the present invention provides an OLED panel packaging structure and a manufacturing method t...

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Abstract

The invention relates to the technical field of packaging, in particular to an OLED panel packaging structure and a manufacturing method thereof. A transparent film layer is arranged on the surface ofcover plate glass, so that the surface of a frit adhesive layer can be smooth; the surface of the transparent film layer is wrapped with the frit adhesive layer, so that saddle-shaped collapse gaps existing in the frit adhesive layer can be supplemented; therefore, the contact area of the frit adhesive layer and backboard glass is increased, the sealing ratio of laser sealing is improved, the sealing airtightness of the panel is better, a transparent film layer structure whose vertical section is T-shaped similarly is beneficial to blocking water and oxygen invasion, and the service life of an OLED device is prolonged.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to an OLED panel packaging structure and a manufacturing method thereof. Background technique [0002] Organic Light-Emitting Diode (OLED-Organic Light-Emitting Diode, referred to as OLED) has the advantages of lighter and thinner, wide viewing angle, simple manufacturing process, low energy consumption, flexible display, etc., and is currently a display technology with great development prospects. The organic light-emitting materials in OLED devices are extremely sensitive to water vapor and oxygen. The intrusion of water and oxygen can easily cause black spots in the light-emitting area of ​​the organic material, and the area of ​​the black spots will gradually expand with time, resulting in light-emitting failure. Frit packaging is commonly used in OLED products. A packaging technology that mainly uses glass glue packaging technology, so improving the airtightness of OLED prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/8426H10K50/844
Inventor 林少钦
Owner FUJIAN HUAJIACAI CO LTD