Silicon wafer laser cutting management system and method

Abstract

The invention relates to a silicon wafer laser cutting management system, comprising a data running main program, a control interface subprogram, an internal data communication subprogram, an externaldata communication subprogram, a data operation subprogram, an I/O communication port subprogram, a hardware driving subprogram, a data storage subprogram, a graphic acceleration processing subprogram, a data detection subprogram based on an interrupt instruction and a data detection subprogram based on the interrupt instruction. An operation method comprises three steps of hardware system prefabrication, software system prefabrication and cutting operation. On one hand, the data storage space can be effectively saved, the requirements of data processing on a hardware system are reduced, andthe universality and the use reliability of the system are greatly improved; on the other hand, when laser cutting is carried out, the laser focus always moves along with the cutting shaft, the consistency of the laser cutting depth is ensured, and cutting errors are automatically repaired, so that the working efficiency and precision of cutting operation are greatly improved.

Description

technical field [0001] The invention relates to a silicon wafer cutting system and equipment, belonging to the field of laser microprocessing. Background technique [0002] At present, in the laser cutting and preparation of silicon wafers, the traditional laser cutting equipment system used can only perform single cutting or multiple cutting with a specific power and specific cutting height in a single cutting. The material thickness of a single silicon wafer itself cannot be absolutely uniform, and the hardware precision of the equipment cannot be absolutely parallel to the laser cutting point, so it is impossible to ensure that the laser focus is at an optimal position every time, resulting in cutting depth Inconsistency, so the failure rate of cutting is relatively high, which leads to relatively low work efficiency, processing quality and yield of current silicon wafer laser cutting, and relatively serious material loss and relatively high processing costs. [0003] Th...

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Problems solved by technology

[0002] At present, in the laser cutting and preparation of silicon wafers, the traditional laser cutting equipment system used can only perform single cutting or multiple cutting with a specific power and specific cutting height in a single cutting. The material thickness of a single silicon wafer itself cannot be absolutely uniform, and the hardware precision of the equipment cannot be absolutely parallel to the laser cutting point, so it is impossible to ensure that the laser focus is at an optimal position every time, resulting in cutting depth Inconsistency, so the cutting failure rate is relatively high, resulting in relatively low work efficiency, processing quality and yield of current silicon wafer laser cutting, and relatively serious material loss and relatively high processing costs

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