Improved photoresist homogenizing method for surface of optical glass
A technology for optical glass and photoresist, which is applied to devices for coating liquids on surfaces, pretreatment surfaces, coating equipment for photoengraving processes, etc. Good uniformity and reduced waste
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] A kind of improved glue-leveling method for the surface of optical glass comprises the following steps:
[0023] Step 1: Place the substrate on the rotating head of the coating table, rotate the substrate at a low speed, drop the photoresist onto the substrate, and spread the photoresist on the substrate;
[0024] Step 2: increasing the rotation speed of the substrate in step 1, so that the substrate rotates at a high speed, and the photoresist becomes thinner on the substrate;
[0025] Step 3: Exhaust and dry the substrate rotating at high speed in step 2, remove excess solvent in the adhesive layer and exhaust solvent vapor, and at the same time heat the substrate to thoroughly dry and cure the photoresist.
[0026] The rotation speed of the substrate in step one is 450rpm.
[0027] In the second step, the rotation speed of the substrate is 2000rpm, and the rotation time is 100s.
Embodiment 2
[0029] A kind of improved glue-leveling method for the surface of optical glass comprises the following steps:
[0030] Step 1: Place the substrate on the rotating head of the coating table, rotate the substrate at a low speed, drop the photoresist onto the substrate, and spread the photoresist on the substrate;
[0031] Step 2: increasing the rotation speed of the substrate in step 1, so that the substrate rotates at a high speed, and the photoresist becomes thinner on the substrate;
[0032] Step 3: Exhaust and dry the substrate rotating at high speed in step 2, remove excess solvent in the adhesive layer and exhaust solvent vapor, and at the same time heat the substrate to thoroughly dry and cure the photoresist.
[0033] The rotation speed of the substrate in step one is 480rpm.
[0034] In step 2, the rotation speed of the substrate is 4000rpm, and the rotation time is 200s.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
