Server integral parallel flow cold plate liquid cooling system

Abstract

The invention discloses a server integral parallel flow cold plate liquid cooling system. Cooling liquid enters the cold liquid sub-runners through the cold liquid joints; the cold liquid is shunted into the cold liquid flow guide channel through the cold liquid shunting channel; cooling liquid enters the CPU flow guide partition block, the chip flow guide partition block and the memory bank flowguide heat dissipation module through the cold liquid flow guide channel and the cold liquid inlet, is heated through heat exchange, flows into the hot liquid outlet through the hot liquid outlet, flows into the hot liquid sub-channel through the flow guide channel outlet and finally flows out through the hot liquid connector. Wherein the cold liquid flow channels among the CPU flow guide spacer block, the chip flow guide spacer block and the memory bank flow guide heat dissipation module are connected in parallel. The server cooling device has the advantages of being reasonable in design, simple in structure, easy to install and detach, suitable for server installation and good in cooling effect.

Description

technical field [0001] The invention relates to the technical field of server heat dissipation, in particular to a liquid cooling system for an integral parallel flow cold plate of a server. Background technique [0002] In a typical computer server ("server"), multiple computer server modules ("modules") are stacked together on a cabinet or within an enclosure to concentrate network resources and minimize footprint. Modules designed for use in server configurations are typically characterized by motherboards containing heat-generating electronic components (such as IC devices) mounted in a combination chassis or housing, which in turn are mounted with other similar modules in racks, blades server cabinets, blade servers, or other support structures. In practice, multiple servers (each comprising multiple modules) are typically installed in an enclosed space, such as a server room or data center. During operation, the electronic components in the individual modules generat...

AI Technical Summary

Problems solved by technology

[0005] In the existing pipe cold plate liquid cooling technology, the liquid cooling pipes are designed with plastic hoses or copper pipes, and there is a great risk of liquid leakage at the joints or welded joints

Moreover, the layout of traditional liquid-cooled pipes is complex, occupying the internal space of the server, which greatly affects the layout of each electronic device in the system. Therefore, the layout of each electronic device in the system can only be one or several types of templates, and it is impossible to achieve any layout.

[0006] At the same time, as core heating devices such as CPUs and GPUs consume more power and produce more and more heat, traditional pipe cold plate liquid cooling devices must be replaced with liquid cooling pipes with larger diameters to meet heat dissipation requirements, and the physical occupancy of pipes The space is further increased, and except for large devices such as CPU, GPU, and memory, it is impossible to dissipate heat for small devices

[0007] In addition, the layout of the liquid cooling tubes in the prior art all adopts the method of serial flow for heat dissipation. This method of serial flow will transfer the heat of one CPU to another CPU, and the heat dissipation efficiency is not high.

In addition, when installing or disassembling the traditional pipeline design, it must be realized with the help of a holding bracket.

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