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Pressure control method and system

A technology of pressure control and pressure, which is applied in the field of pressure control methods and systems, can solve the problems of complex structure, high cost, and difficult realization of the control system, and achieve the goal of reducing pressure control costs, short time consumption, and convenient chamber pressure control Effect

Pending Publication Date: 2020-12-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the strong control method of the transmission chamber realized by this patent, the structure of the control system is complicated, and the cost is high, so it is not easy to realize

Method used

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  • Pressure control method and system
  • Pressure control method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Such as figure 1 Shown is a flow chart of the pressure control method provided by the embodiment of the present invention. The pressure control method in the embodiment of the present invention is used to control the pressure of the chamber in the transmission platform, including the following steps:

[0035] Step 100: start.

[0036] Step 101: Perform background pumping on the chamber until the pressure in the chamber reaches the preset background pressure value; specifically, the preset background pressure value is determined by different chambers and processes, for example, the chamber is a transition chamber chamber and silicon wafer transfer in the transition chamber, the preset background pressure value is 50mTorr.

[0037] Step 102: Inflate the chamber with air, and stop the inflation after a first set time.

[0038] Specifically, the first set time period is a configurable value, which is determined by the operator according to process requirements, for exampl...

Embodiment 2

[0048] Such as figure 2 Shown is another flow chart of the pressure control method provided by the embodiment of the present invention. The pressure control method in the embodiment of the present invention includes the following steps:

[0049] Step 200: start.

[0050] Step 201: Determine whether the pressure of the chamber in the transmission platform is the target pressure value; if yes, return to step 201; otherwise, execute step 202.

[0051] Step 202: Perform background pumping on the chamber until the pressure in the chamber reaches a preset background pressure value.

[0052] Step 203: Inflate the chamber, stop the inflation after the first set time, and adjust the time-consuming pressure control by adjusting the amount of air inflated into the chamber.

[0053] Step 204: Pumping the chamber at a predetermined pumping speed until the pressure in the chamber reaches the target pressure value, and returning to step 201.

[0054] In the pressure control method provided...

Embodiment 3

[0056] For the above pressure control method, the present invention also provides a pressure control system, which is used to control the pressure of the chamber in the transfer platform, such as figure 2 As shown, the pressure control system in this embodiment includes: a gas source 1 , a vacuum pump 2 , a pressure sensor 3 , a first switch 4 , a second switch 5 and a processor 6 .

[0057] The pressure sensor 3 is used to detect the pressure of the chamber 7 in the transmission platform, and transmit the pressure to the processor.

[0058] The first switch 4 is arranged on the gas path between the gas source 1 and the chamber 7 .

[0059] The second switch 5 is arranged on the gas path between the vacuum pump 2 and the chamber 7 .

[0060] The processor 6 performs background pumping on the chamber through the second switch 5 and the vacuum pump 2 until the pressure reaches the preset background pressure value; inflates the chamber through the first switch 4 and the gas sou...

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Abstract

The invention provides a pressure control method system, which are used for carrying out pressure control on a cavity in a transmission platform, and the method comprises the following steps: S1, carrying out background air exhaust on the cavity until the pressure of the cavity reaches a preset background pressure value; S2, inflating the cavity, and stopping inflation after first set time; and S3, the cavity being subjected to air exhaust at a preset air exhaust speed until the pressure in the cavity reaches a target pressure value. According to the invention, the pressure control cost of thetransmission platform is reduced.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, in particular to a pressure control method and system. Background technique [0002] The semiconductor process usually processes silicon wafers through physical and chemical means, and the equipment that completes the process is called semiconductor equipment. The processing of silicon wafers in semiconductor equipment is usually carried out in a sealed container under a vacuum environment, which is called a process chamber. In addition to the process chamber, semiconductor equipment also has a transfer platform. The transfer platform includes a transfer chamber and a transition chamber. The transfer chamber needs to maintain a vacuum environment, and the transition chamber is converted between a vacuum state and an atmospheric state. The chamber The control of the pressure state will also affect the process state of the silicon wafer in the process chamber; the transfer chambe...

Claims

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Application Information

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IPC IPC(8): H01J37/32
CPCH01J37/32449
Inventor 耿宏伟李强白志民顾文亮李雷
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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