Printed circuit board and manufacturing method thereof
A printed circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of many defective products and low production efficiency of PCB laser two-dimensional codes, so as to improve product yield and prevent The effect of bulging and inaccurate alignment, shortening production time
Active Publication Date: 2022-03-25
GOERTEK OPTICAL TECH CO LTD
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Problems solved by technology
[0005] The main purpose of the present invention is to propose a printed circuit board and its manufacturing method, aiming to solve the technical problems of low production efficiency and many defective products of PCB laser two-dimensional codes
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[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0046] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
[0047]In addition, if there are descriptions involving "first", "second" and s...
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The invention discloses a printed circuit board and a manufacturing method thereof. The printed circuit board includes a surface layer, a substrate and a bottom layer which are sequentially stacked. The surface layer is covered with a solder resist ink layer and a radium engraving ink layer. The ink layer is arranged on the same layer, wherein, the area of the surface layer corresponding to the radium engraving ink layer is provided with a copper skin, and the radium engraving ink layer is radium engraved with hollow points, so that the copper skin leaks from the hollow points to form a two-dimensional code pattern. Alternatively, the surface layer includes a wiring layer and a laser engraving ink layer, and the wiring layer and the laser engraving ink layer are arranged on the same layer, wherein the wiring layer is covered with a solder resist ink layer. The substrate is an insulating substrate and the substrate is white, and the laser engraving ink area is engraved with hollow points, so that the substrate leaks out of the hollow points to form a two-dimensional code pattern; or, the substrate is a conductive substrate, and an insulating layer is provided between the surface layer and the substrate , the insulating layer is white, and the radium engraving ink area is engraved with hollow points, so that the insulating layer leaks outside the hollow points to form a two-dimensional code pattern. The invention has the advantages of high production efficiency and high product pass rate.
Description
technical field [0001] The invention relates to the technical field of design and manufacture of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] In the electronics industry, in order to facilitate the traceability of each product, it is necessary to mark a unique code on the product, that is, the current common QR code, which is used to identify the identity information of the product. Bind the key station test items and test results of the product in the production line production process with the QR code of each product for later query. The traditional product QR code is usually a paper QR code, which is pasted on the product, but the paper QR code is easy to fall off, wasting manpower and material resources, so it has been basically eliminated. [0003] At present, the two-dimensional code of the product is usually obtained by laser laser on the PCB (printed circuit board). Specifically, ...
Claims
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IPC IPC(8): H05K1/02H05K3/00H05K3/28
CPCH05K1/0269H05K3/0026H05K3/288H05K3/282H05K2201/09927H05K2203/107
Inventor 王芳芳
Owner GOERTEK OPTICAL TECH CO LTD