Semiconductor package and method of forming same

Abstract

The method comprises the following steps: forming a first packaging piece, forming second packaging pieces and forming a third packaging piece, then mounting the first packaging piece in a middle areaof a flexible circuit substrate, respectively mounting the two second packaging pieces in two opposite side edge areas of the flexible circuit substrate, forming a plurality of first through holes and second through holes which are formed at intervals, depositing a resin material in the first through holes and the second through holes to form first reinforcing columns and second reinforcing columns respectively, wherein the coefficient of thermal expansion of the resin material in the first reinforcing columns and the second reinforcing columns is smaller than the coefficient of thermal expansion of the resin material in the flexible circuit substrate, and arranging the third packaging piece on the first packaging piece, and upwards bending two opposite side edge areas of the flexible circuit substrate to enable each second packaging piece to be attached to the side wall of the first packaging piece and the side wall of the third packaging piece.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor packaging and a forming method thereof. Background technique [0002] With people's continuous pursuit of miniaturization, systematization, and multi-function of electronic products, the feature size of VLSI is constantly shrinking. Correspondingly, the semiconductor industry has also developed rapidly. Electronic products are miniaturized and denser, with more and more functions, product sizes are getting smaller and smaller, and the distance between solder balls is getting smaller and smaller. On this basis, the POP stacking structure has also been developed rapidly. Among them, in the packaging components combined with the flexible substrate stacking structure and the POP stacking structure, chips with different functions can be stacked vertically and horizontally, thereby achieving high-density integration. , Smaller package size, superior product perfo...

AI Technical Summary

Problems solved by technology

However, in the existing packaging components that combine the flexible substrate stacking structure and the POP stacking structure, it is easy to have the disadvantages of delamination of the packaging components, poor stability of the packaging components, and failure of the packaging components.

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