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Wafer cutting device and cutting method

A cutting device and wafer technology, applied in the direction of fine working devices, working accessories, electrical components, etc., can solve the problems of difficulty in ensuring cutting quality, low efficiency, and shortening the service life of the cutting knife, so as to reduce the risk of rupture and prolong the Service life and the effect of ensuring cutting quality

Active Publication Date: 2022-03-29
珠海市中芯集成电路有限公司
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Problems solved by technology

With the growing demand for wafers, the processing efficiency and yield requirements of wafers are also getting higher and higher. In the prior art, the same dicing line is mostly cut 4 to 5 times with the same dicing knife. The cutting method has the problems of low efficiency, reducing the service life of the cutting knife and difficult to guarantee the cutting quality

Method used

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  • Wafer cutting device and cutting method
  • Wafer cutting device and cutting method
  • Wafer cutting device and cutting method

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] see Figure 1 to Figure 4 A wafer cutting device is shown, which includes a base 100 and a first cutting assembly and a second cutting assembly respectively arranged on the base 100, a wafer 400 is located below the base 100, wherein the base 100 is connected with a linear drive mechanism 101, which can be a conventional linear slide or a ball screw arranged vertically. The linear drive mechanism 101 can drive the base 100 to move vertically up and down. The first cutting The assembly and the second cutting assembly can move downward with the base 100 to approach and cut the wafer 400 or mo...

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Abstract

The present invention relates to the technical field of wafer preparation, in particular to a wafer cutting device and a cutting method. The first cutting assembly and the second cutting assembly of the present invention rotate synchronously, which can ensure the quality of cutting. At the same time, the first cutting assembly and the second cutting assembly The cutting components can overlap the cutting paths, thereby improving cutting efficiency and reducing the risk of chipping or wafer breakage. When the cutting paths of the first cutting component and the second cutting component do not coincide, the cutting efficiency is improved; and the cleaning components include cleaning Water pipe, the first water outlet and the second water outlet are opened on the cleaning water pipe. The first water outlet faces the wafer, which can clean the dust attached to the surface of the wafer and prevent the dust from affecting the quality of cutting and subsequent packaging. The second water outlet Facing the first cutting assembly and / or the second cutting assembly, the first cutting assembly and / or the second cutting assembly can be effectively cooled, prolonging the service life of the first cutting assembly and / or the second cutting assembly.

Description

technical field [0001] The invention relates to the technical field of wafer preparation, in particular to a wafer cutting device and a cutting method. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications. Recently, 12 inches or even larger specifications have been developed. With the growing demand for wafers, the processing efficiency and yield requirements of wafers are also getting higher and higher. In the prior art, the same dicing line is mostly cut 4 to 5 times with the same dicing knife. The cutting method has the problems of low efficiency, reducing the service life of the cutting knife and being di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/02B28D7/02B28D7/00H01L21/67
CPCB28D5/024B28D5/029B28D5/026B28D5/0064B28D5/0076H01L21/67092
Inventor 吴俊周永建
Owner 珠海市中芯集成电路有限公司
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