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A kind of low dielectric unsaturated benzoxazine resin composition and preparation method

A resin composition and benzoxazine technology are applied in the field of low-dielectric unsaturated benzoxazine resin compositions and preparations, and can solve the problems of low crosslinking density, high brittleness, insufficient dielectric properties, etc. High transition temperature, high mechanical properties, and the effect of increasing crosslinking density

Active Publication Date: 2021-11-30
材翼新材料科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The problem to be solved by the present invention is: based on the current 5G high-frequency information transmission requirements for the dielectric properties and heat resistance of the resin matrix of the copper-clad laminate material, the benzoxazine resin system has insufficient dielectric properties, high brittleness, and low cross-linking density. etc., the present invention introduces an unsaturated hydrocarbon structure into the numerical structure of benzoxazine to provide a low-dielectric unsaturated benzoxazine resin composition and a preparation method

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  • A kind of low dielectric unsaturated benzoxazine resin composition and preparation method

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Embodiment 1

[0024] Preparation method of low dielectric unsaturated benzoxazine resin composition:

[0025] (1) Thimmer 134 g of allyl phenol is added to dry three flasks, warmed to 40 ° C, slowly drop 200 g vinyl osmethililine into the system, and then heat up the system to 50 ° C for 2 hours after the drop is added. The temperature is reduced to room temperature;

[0026] (2) Take 65 g of polymethylene formaldehyde to the product of step (1), slowly warming up to 50 ° C, the treatment system is no longer warming to react to 100 ° C for 2 hours, and the system temperature is reduced to 80 ° C vacuum removal system The water and small molecule impurities can be obtained by an unsaturated group of benzoxazine resins;

[0027] (3) 50 g of tri-cyananate, 5g isopropyl hydrogen peroxide initiator, 0.25 g of naphthoquinone mixed-polymer initiators, and 0.25 g of naphthoquinone mixed-polymer initiating agent Unsaturated benzoxazine resin composition.

[0028] The viscosity of the resulting product (...

Embodiment 2

[0030] Preparation method of low dielectric unsaturated benzoxazine resin composition:

[0031] (1) Thrombin is added to the dry three flask, and the temperature is raised to 30 ° C, and the 54 g of allylamine is slowly dropped into the system. After the dropping is added, the system is warmed to 40 ° C for 2 hours, and then the system will be systematically Temperature falls to room temperature;

[0032] (2) Extension 62 g of polymethylene formaldehyde is added to the product of step (1), slowly warming up to 50 ° C, the treatment system is no longer warming to react to 90 ° C for 2 hours, and the system temperature is reduced to 80 ° C to remove the system The water and small molecule impurities can be obtained by an unsaturated group of benzoxazine resins;

[0033] (3) 40 g of tri-cyanate, 4.5 g of isopropyl hydrogen peroxide initiator, 0.25 g of phenyl dioxide, 0.25 g of naphthoquinone mixed polymerization agent A low dielectric unsaturated benzoxazine resin composition can be...

Embodiment 3

[0036] Preparation method of low dielectric unsaturated benzoxazine resin composition:

[0037] (1) Take 156 g of methoxyethylphenol to the dry three flask, warmed to 30 ° C, slowly drop 120 g of ethynyl aniline into the system, and the system was tapered to 40 ° C for 2 hours after the dropwise addition. Then reduce the temperature temperature to room temperature;

[0038] (2) Welder 60 g of polymethoxaldehyde is added to the product of step (1), slowly warming up to 40 ° C, the treatment system is no longer warming to react to 100 ° C for 2 hours, and the system temperature is reduced to 80 ° C vacuum removal system The water and small molecule impurities can be obtained by an unsaturated group of benzoxazine resins;

[0039] (3) 50 g of an alpha-methylstyrene, 5 g of isopropylstylene hydrogen peroxide initiator, 0.25 g of a phenol-added agent, and 0.25 g of a phenol-added agent, and a low dielectric unsaturated is obtained. Benzoxazine resin composition.

[0040] The viscosity ...

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Abstract

The invention discloses a low dielectric unsaturated benzoxazine resin composition and a preparation method thereof. The low dielectric unsaturated benzoxazine resin composition comprises an unsaturated group-containing benzoxazine resin, an unsaturated crosslinking monomer, an initiator and a polymerization inhibitor. The preparation method is as follows: prepare benzoxazine resin with high unsaturated functionality by reacting unsaturated bond-containing phenol, unsaturated bond-amine and paraformaldehyde; combine unsaturated benzoxazine resin with cross-linking agent, initiator After mixing the agent and polymerization inhibitor evenly. The invention has simple process, convenient operation and easy control of process conditions. The low dielectric unsaturated benzoxazine resin composition prepared by the invention has the characteristics of low viscosity, high thermal stability, high glass transition temperature, low water absorption, low dielectric, halogen-free and the like. It can overcome the low crosslinking density of traditional benzoxazine resins, improve heat resistance and mechanical strength, and can also be used in conjunction with other thermosetting resins. It can be used as copper clad laminate matrix resin, electronic packaging insulation materials and other fields.

Description

Technical field [0001] The present invention relates to a low dielectric unsaturated benzoxazine resin composition and a preparation method, which belongs to the technical field of high-frequency coated copper plate low dielectric resin. Background technique [0002] Benzoxazine resin is a new type of high-performance thermosetting resin, which has no small molecule in the curing process, low curing shrinkage, less air hole. At the same time, the resin has good flame retardant properties, thermal mechanical properties, dielectric properties, no halogen, etc., which makes it widely applied to mechanical components, friction materials, ablation resistant materials, halogen-free flame-fired copper sheet materials and High temperature resistant materials and other fields. With the rapid development of 5G information technology, the dielectric properties and mechanical properties of the coated copper material resin matrix have a higher demand, that is, lower dielectric constants and d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/00C08F226/06C08F212/12C08G14/073
CPCC08F283/00C08G14/06C08F226/06C08F212/12
Inventor 郭康康齐会民常伟刘农强孟庆斌
Owner 材翼新材料科技(苏州)有限公司