Method for avoiding drilling abnormity of rigid-flex board

Abstract

The invention discloses a method for avoiding drilling abnormality of a rigid-flex board, which comprises the following steps of: S1, preparing a cushion wood board according to the expansion-contraction ratio of the rigid-flex board, and drilling two drilling positioning holes on the cushion wood board, S2, outputting LDI exposure data according to the height difference area of the back face of the rigid-flex board in engineering, and exposing the area needing to be filled, S3, pasting a dry film on the front surface of the cushion wood board, performing LDI secondary drilling positioning hole exposure, and performing exposure according to engineering data, S4, removing the dry film in an unwanted area on the front surface of the cushion wood board through development, and leaving the dryfilm in an area required to be filled on the cushion wood board, and S5, sleeving PIN nails with the cushion wood board filled with the dry film, and then sleeving the PIN nails with the rigid-flex board. According to the rigid-flex board, four procedures such as film pressing, exposure, development and film removing are not needed, the quality risk hidden danger that a dry film remains at the bottom of a hole when the rigid-flex board with a blind hole is subjected to film removing is avoided, the production cost is effectively reduced, and the production yield is increased.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a method for avoiding abnormal drilling of a rigid-flex board. Background technique [0002] The birth and development of FPC and PCB gave birth to the new product of soft and hard board. Therefore, the soft and hard combination board is a circuit board with FPC characteristics and PCB characteristics formed by combining the flexible circuit board and the rigid circuit board through lamination and other processes according to the relevant process requirements. [0003] Because the rigid-flex board is a combination of FPC and PCB, the production of the rigid-flex board should have both FPC production equipment and PCB production equipment. First, the electronic engineer draws the circuit and shape of the flexible board according to the requirements, and then sends it to the factory that can produce the soft-hard board. After the CAM engineer processes and plans ...

AI Technical Summary

Problems solved by technology

[0004] Due to the customer's design needs, the middle layer of this type of rigid-flex board needs to be hollowed out. After lamination, the rigid-flex board will appear in some areas where the PAD has a high and low difference. During mechanical drilling, the position of the hollowed out area cannot match The lower backing board is flattened, and the bottom hole of the soft-hard combination board will be suspended when drilling, resulting in serious crater anomalies in the drilled bottom hole

[0005] In response to the above problems, the current basic practice in the industry is to directly press the dry film on the rigid-flex board to improve the crater anomaly caused by such a height difference. Development-drilling-removal-electroplating), there is a risk of changing the expansion and contraction ratio of the rigid-flex board, and if there is a blind-hole rigid-flex board, it is easy to cause a high risk of dry film debris remaining in the blind hole during film removal. Bottom of hole causing plated hole anomalies