A Novel Multiscale Thermal Management Structure and Micro-assembly Method

Abstract

The invention provides a novel multi-scale thermal management structure, comprising: a high-power chip, a chip-level micron-scale heat dissipation microchannel, a package-level millimeter-scale microchannel, and a system-level centimeter-scale macroscopic liquid supply network. The high-power chip Through low-void welding and low thermal resistance integration of chip-level micro-scale heat dissipation micro-channels, chip-level micro-scale heat-dissipation micro-channels and package-level millimeter-scale micro-channels are interconnected with liquid networks through air-tight welding; package-level millimeter-scale micro-channels The system-level centimeter-scale macroscopic liquid supply network is interconnected with double-pass watertight connectors; the system-level centimeter-scale macroscopic liquid supply network is interconnected with the external liquid supply system through liquid cooling connectors. The solution of the invention solves the technical problem of organically combining micro-scale micro-channels with complex macro-system equipment; and solves the problem of uniform heat dissipation of arrayed micro-channels through the step-by-step increase of the channel scale.

Description

technical field [0001] The present invention relates to the technical field of heat dissipation of microelectronics, in particular to a novel multi-scale thermal management structure and a micro-assembly method. Background technique [0002] In the next-generation information system, the RF array aperture will develop in the direction of longer range and smaller volume, and GaN chips and arrayed systems are widely used. However, in the microwave frequency band, GaN devices have high power density, and the self-heating effect is quite serious. For example, GaN HEMT devices can achieve power densities more than 10 times higher than conventional Si and GaAs devices; their heat flux density is greatly increased, even as high as 600W / cm 2 above. [0003] Traditional passive heat dissipation technology can no longer meet the heat dissipation requirements of high-power GaN chips. This is because: traditional passive heat dissipation uses metal heat sinks, which dissipate heat th...

AI Technical Summary

Problems solved by technology

However, there are still few reports on how to integrate micro-scale micro-channels into the system and organically combine micro-scale micro-channels with complex macro-system equipment to construct a new multi-scale thermal management structure.

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