Circuit substrate feeding device and method thereof

Abstract

The invention belongs to the technical field of circuit substrate automatic production, and relates to a circuit substrate feeding device which comprises a circuit substrate bottom plate, a circuit substrate sliding rail, a circuit substrate feeding support, a circuit substrate moving air cylinder, a driving assembly, a first circuit substrate feeding assembly, a second circuit substrate feeding assembly and a circuit substrate transferring assembly. The circuit substrate feeding support is arranged on the circuit substrate bottom plate through the circuit substrate sliding rail, and the circuit substrate moving air cylinder is arranged on a machine frame. The driving assembly is arranged in the middle of the circuit substrate feeding support and used for driving the first circuit substrate feeding assembly and the second circuit substrate feeding assembly to act. The circuit substrate transfer assembly is used for transferring a circuit substrate. The feeding device and the method have the advantages that the feeding time of the circuit substrate is saved, the feeding efficiency is improved, and the stability and accuracy of copper film conveying are improved.

Description

technical field [0001] The invention belongs to the technical field of automatic production of circuit substrates, and in particular relates to a circuit substrate feeding device and a method thereof. Background technique [0002] With the gradual deepening of electronic technology in various application fields, highly integrated circuit boards have become an inevitable trend. Highly integrated package modules require a good heat dissipation carrying system, while traditional circuit boards FR-4 and CEM-3 are in TC (thermal conductivity ) has become a bottleneck restricting the development of electronic technology. The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC index of its load-carrying circuit boards. In the field of high-power LED lighting, materials with good heat dissipation properties such as metal and ceramics are often used to prepare circuit substrates. [0003] The circuit substrate is a thermall...

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Problems solved by technology

[0007] The purpose of the present invention is to solve the above-mentioned problem of low film feeding efficiency of the existing circuit substrate, and to provide a circuit substrate feeding device, which drives the first circuit substrate feeding assembly and the second circuit substrate feeding assembly through a drive assembly. Component action, when the first circuit substrate feeding component is raised to load the material, the second circuit substrate feeding component is lowered to take the material, reducing the waiting time for loading between the two circuit substrates

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