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Stacked decoupling network

A decoupling network, stacked technology, used in antenna coupling, electrical components, electrical solid devices, etc., can solve the problems of channel capacity reduction, signal-to-noise ratio deterioration, unit gain reduction, etc. The effect of resonance stability and improved isolation

Pending Publication Date: 2021-01-01
XIAN LAMBDA COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (2) Decrease in radiation efficiency;
[0007] (3) Decrease in unit gain;
[0008] (4) Deterioration of signal-to-noise ratio;
[0009] (5) Reduction of channel capacity

Method used

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Embodiment Construction

[0031] like figure 1 The orthogonal hybrid network shown can be implemented with metal microstrip lines. The present invention is improved on this basis. By designing a special-structured orthogonal hybrid network,

[0032] like figure 2 As shown in the figure, the stacked decoupling network of the present invention includes a substrate on which metal through-holes are arranged in a mouth-shaped array, and metal strips are also distributed on the upper and lower layers of the substrate for connecting adjacent metal through-holes. Make it a whole and form the word unit. The metal strips are distributed up and down between adjacent metal through holes. The four end corners of the mouth-shaped unit are extended with four connecting arms to the left and right sides, and the connecting arms are also composed of metal through holes and metal strips, and the connection method is the same as that of the mouth-shaped unit.

[0033] The metal strips are staggered up and down betwee...

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Abstract

The invention discloses a stacked decoupling network, and the network comprises a substrate, wherein metal through holes distributed in a square array mode are formed in the substrate, and metal strips are further distributed on the upper layer and the lower layer of the substrate and used for connecting the adjacent metal through holes into a whole to form a square unit; the the metal strips aredistributed up and down between the adjacent metal through holes in a staggered manner. Four connecting arms extend from four end corners of the square unit to the left side and the right side, each connecting arm is also composed of a metal through hole and a metal strip, and the connecting mode is the same as that of the square unit. The metal through holes in the substrate are distributed in abroken line shape on each side of the square array, and the upper layer and the lower layer of the corresponding substrate are connected with the metal strips of the adjacent metal through holes in abroken line shape. According to the core principle of an existing orthogonal hybrid network, the orthogonal hybrid network of a folding structure is designed, a chip is integrated through the low-temperature co-fired ceramic technology, and the chip generates a decoupling effect within a certain frequency band and is used for decoupling among multi-antenna systems.

Description

technical field [0001] The invention relates to the field of multi-antenna decoupling, in particular to a stacked decoupling network. Background technique [0002] With the rapid development of mobile communication systems, radio frequency spectrum resources are increasingly scarce, and how to provide higher-quality and faster communication services has become a research hotspot in the fifth-generation mobile communication system (5G). In this context, the multiple-input multiple-output (MIMO) communication technology, which has been proposed for a long time, has become a key technology in the 5G system. [0003] Multiple-input multiple-output (MIMO) technology refers to the simultaneous use of multiple transmit and receive antennas at the transmitter and receiver, so that signals are transmitted and received through multiple antennas at the transmitter and receiver. Therefore, the multiple-input multiple-output technology can realize high-speed, large-capacity data transmi...

Claims

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Application Information

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IPC IPC(8): H01Q1/52H01L27/02
CPCH01Q1/523H01L27/0203
Inventor 刘洋王璟珂赵鲁豫
Owner XIAN LAMBDA COMM TECH CO LTD