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Manufacturing method of medical instrument detection plate

A technology of medical equipment and manufacturing method, which is applied in the field of circuit boards, can solve problems such as the insulation of the solder barrier layer is easy to fall off, and achieve the effects of high product value, strong competitiveness, and improved reliability

Pending Publication Date: 2021-01-05
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above problems, the present invention provides a method for manufacturing a medical instrument detection board, which improves the problems of the traditional ink solder barrier layer being easy to fall off and poor insulation.

Method used

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  • Manufacturing method of medical instrument detection plate

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the embodiments and the accompanying drawings.

[0033] A method for manufacturing a medical instrument detection board, comprising the following steps:

[0034] (1) Cutting, cutting the base material according to the preset size;

[0035] (2) Inner layer graphics and inner layer etching; complete the inner layer circuit production, and then conduct internal inspection to screen out unqualified products;

[0036] (3) The multi-layer substrate is pressed into a whole board, and then drilled after lamination, and then copper sinking or plate electrical is carried out to realize the electrical conduction of the multi-layer substrate;

[0037] (4) Circuit pattern (1), etching (1): make circuit pattern (1) by pressing dry film, exposure and development, the entire board is provided with pads 1 arranged in arrays, and etching will etch out the pad spacing 2, Pad spacing 2 is the solder-proof area betw...

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Abstract

The invention discloses a manufacturing method of a medical instrument detection plate. The manufacturing method comprises the following steps: (1) performing cutting; (2) carrying out inner-layer patterning, inner-layer etching and internal inspection; (3) pressing a multilayer substrate into a whole board, drilling after pressing, and then carrying out copper deposition or board electrification;(4) etching a circuit pattern (1) , etching (1), wherein the interval between the bonding pads is etched, and the interval between the bonding pads is a solder mask area between the adjacent bondingpads; (5) performing resin hole plugging, wherein the resin hole plugging sequentially comprises the following steps of aluminum sheet hole plugging, pre-baking, resin silk-screen printing, board copying and resin grinding; (6) etching the circuit pattern (2); and (3) etching; (7) carrying out AOI (2) solder mask, character and surface treatment; and (8) forming, testing, FQC and packaging. According to the invention, the resin ink is silk-screened at the bonding pad interval between the adjacent bonding pads, so that the solder mask layer in the solder mask area can be prevented from fallingoff, and the product reliability is improved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a manufacturing method of a medical instrument detection board. Background technique [0002] With the continuous development of medical testing technology and the in-depth research of basic medicine, testing instruments have become very important auxiliary diagnostic equipment in modern hospitals and an important part of modern laboratory medicine. High technology and electronic computers play an important role in experimental methodology. The rapid development of medical testing instruments and their gradual popularization in clinical laboratories. [0003] Using the new effects of physics and high-tech achievements to develop new sensor technology and nano-detection technology with high sensitivity, high stability, and strong anti-interference ability, a new type of high-precision, high-resolution inspection instrument has been developed. The application of sensors and chips w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06H05K3/28
CPCH05K3/00H05K3/06H05K3/282
Inventor 赵斌胡新星张军杰胡桂
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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