The invention provides a production process of powder special for wafers. The production process includes the following steps of 1, wheat preparation, wherein wheat with the wet gluten content of 30.0%+/-0.5% and the stabilization time of 4.0%+/-1.0 min is subjected to cleaning and impurity removal through the three-sieving, two-beating and two-stone-removal process; 2, wheat wetting, wherein the wheat cleaned in the step 1 is wet; 3, grinding, wherein the wheat wet in the step 2 is ground, sieved and purified, and outgoing powder of following powder tubes of 1B1, 1B2, 1B3, 1B4, 3Bc1, 3Bc2, 3Bc3, 3Bc4, 4Bf1, 4Bf2, D21, D22, D3, D4, 4M and 5M is selected as raw materials of the powder special for the wafers; 4, drying, wherein the raw materials obtained in the step 3 are put in a dryer to be dried to become basic powder; 5, powder preparation, wherein corn starch, wheat starch and MD20 maltodextrin are added into the basic powder obtained in the step 4, the materials are mixed to be uniform, and the powder special for the wafers is made.