Method for preventing gold plating lateral erosion and gold finger copper exposure of printed circuit boards

Abstract

The invention relates to a process for printed circuit boards, belongs to the technical field of printed circuit boards, and particularly relates to a method for preventing gold plating lateral erosion and gold finger copper exposure of printed circuit boards. The method has the advantages that gold plating treatment is carried out on the surfaces of circuit boards at first, then solder mask treatment is carried out on the surfaces, which are already subjected to gold plating treatment, of the circuit boards, accordingly, solder mask attachment effects can be prevented from being affected by the length of the soaking time of gold tanks and fluctuation of currents of the gold tanks in gold plating procedures, and gold finger root lateral erosion can be prevented; the problems of incapability of coating gold on gold fingers and gold finger copper exposure during gold plating due to the fact that printing ink is not thoroughly developed or is reversely adhered can be solved; gold platinglateral erosion and gold finger copper exposure of the printed circuit boards truly can be prevented by the aid of the method.

Description

technical field [0001] The invention relates to a printed circuit board process, which belongs to the technical field of printed circuit boards, and in particular relates to a method for preventing the gold-plated side erosion of the printed circuit board and the exposed copper of gold fingers. Background technique [0002] With the rapid improvement of industrial development capabilities in various countries around the world, the consumer market is getting bigger and bigger, and printed circuit board (PCB) companies are growing rapidly. [0003] The known manufacturing process of a printed circuit board mainly includes the following steps: performing solder resist treatment on the surface of the printed circuit board, then pasting a dry film, and then performing gold plating. [0004] Since the anti-soldering treatment is to use ink to protect the parts that do not need to be welded, the lack of the above-mentioned conventional methods mainly includes: [0005] (1) Solder ...

AI Technical Summary

Problems solved by technology

[0006] (2) Solder resist first, and then gold plating, because the ink is not developed cleanly or the ink is anti-sticky, it will cause the gold fingers to be unable to be gold-plated, resulting in exposed copper on the gold fingers

[0007] In response to the above-mentioned deficiencies, the general practice of the industry is to repair the gold-plated side etching and gold finger exposed copper. Although the gold-plated side etching and gold finger exposed copper can be improved, it requires additional labor and leads to an increase in the cost of printed circuit boards.

[0008] In addition, although the above-mentioned repairing method can improve the gold-plated undercut and the exposed copper of the gold finger, there are still defects due to imperfect repairing, resulting in a high failure rate of the printed circuit board

Images