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Cleaning device and method for rotary target material

A technology of cleaning device and rotary drive device, which is applied to grinding drive device, grinding/polishing safety device, and parts of grinding machine tools, etc., can solve the problems of increasing the risk of target falling off, binding metal melting, and high cost, Achieve the effect of ensuring uniformity and coating quality and solving uneven sputtering

Pending Publication Date: 2021-01-08
XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cost of such treatment is high, and it is easy to cause the melting of the binding metal during baking and plasma treatment, increasing the risk of target falling off and even increasing the risk of target cracking
[0005] In addition, a high-pressure spray cleaning process is also used to spray cleaning agents on the target surface under high pressure, but this cannot guarantee the smoothness and roughness of the target surface, nor can it deal with the inevitable step problem caused by binding
[0006] At present, there is a lack of a cleaning device and cleaning method that can clean the target without damaging the target.

Method used

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  • Cleaning device and method for rotary target material
  • Cleaning device and method for rotary target material
  • Cleaning device and method for rotary target material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as Figure 1 to Figure 3 As shown, a cleaning device for a rotating target in a preferred embodiment of the present invention includes a frame 1, a mounting mechanism 4, a grinding and spraying mechanism 5, and a control device 2; the mounting mechanism 4 includes a rotary drive device 41 and a The positioning assembly 42 for the position of the liner 3, the rotation driving device 41 and the positioning assembly 42 are all installed on the frame 1, the rotation driving device 41 is connected with the positioning assembly 42, and the rotation driving device 41 can drive the positioning assembly 42 to rotate to drive the lining Pipe 3 rotates on frame 1; Grinding and spraying mechanism 5 comprises walking drive unit 51, first moving block 52, pressure device 55, spraying device 53, grinding piece (not shown in the figure) and polishing piece (not shown in the figure) shown), the walking drive device 51 is installed on the frame 1, the output end of the walking drive...

Embodiment 2

[0048] In order to solve the same technical problem, the present application also provides a cleaning method for a rotating target, which includes the following steps:

[0049] Step 1: Install the target material 10 on the liner 3, and install the liner 3 on the positioning assembly 42;

[0050] Step 2: the control device 2 controls the rotation driving device 41 to drive the positioning assembly 42 to rotate, so as to drive the liner 3 and the target material 10 to rotate on the frame 1, and at the same time, the liquid spray device 53 sprays detergent on the surface of the target material 10, The walking driving device 51 drives the first moving block 52 to drive the grinding piece to move, and the grinding piece is ground on the surface of the target 10;

[0051] Step 3: Stop grinding, the liquid spraying device 53 continues to spray detergent on the surface of the target 10, the traveling driving device 51 drives the first moving block 52 to drive the polishing piece to mo...

Embodiment 3

[0068] The difference between the present embodiment and the second embodiment is that the method for cleaning the rotating target provided by the third embodiment includes the following steps:

[0069] Step 1: select a liner 3 with a length of 3 meters, bind the 8-section copper indium gallium rotating target 10 on the liner 3, and assemble the liner 3 into the installation position, so that the two ends of the liner 3 touch the Connected to the surface of the first top cone 421 and the second top cone 422 .

[0070] Step 2: Assemble the grinding piece under the pressure device 55, the grinding piece is 360CW waterproof sandpaper, the control device 2 drives the pressure device 55 to press down, so that the grinding piece is close to the surface of the target 10, the pressure of the pressure device 55 is 0.2MPa . The control device 2 controls the rotation driving device 41 to drive the first cone 421 to rotate, and drives the target 10 and the liner 3 to rotate at a speed of...

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Abstract

The invention relates to the technical field of sputtering target material processing devices, and discloses a cleaning device and method for a rotary target material. The cleaning device comprises arack, a mounting mechanism, a grinding and spraying mechanism and a control device; the mounting mechanism comprises a rotary driving device and a positioning assembly used for positioning the position of a liner tube, the rotary driving device and the positioning assembly are both mounted on the rack, and the rotary driving device can drive the positioning assembly to rotate so as to drive the liner tube to rotate on the rack; the grinding and spraying mechanism comprises a walking driving device, a first moving block, a pressure device, a liquid spraying device, a grinding piece and a polishing piece, the walking driving device is installed on the rack, the walking driving device is connected with the first moving block, the walking driving device can drive the first moving block to moveon the rack, and the pressure device and the liquid spraying device are both installed on the first moving block; and the grinding piece and the polishing piece are both connected to the pressure device. Under the condition that the quality of the target material is ensured, the uniformity and the coating quality of the target material during sputter coating can be ensured.

Description

technical field [0001] The invention relates to the technical field of processing devices for sputtering targets, in particular to a cleaning device and method for rotating targets. Background technique [0002] Sputtering coating has now become one of the most important technologies in industrial coating production. Ceramic targets such as zinc telluride, cadmium telluride, cadmium zinc telluride and other sputtering targets are used as raw materials for magnetron sputtering coatings. Their quality has a great impact on the performance of the film layer and will also affect the production efficiency of the coating. and cost and quality. With the rapid development of the electronic information industry, the size of chips continues to decrease, and the integration of electronic devices in integrated circuits continues to increase, and the requirements for the uniformity of sputtering coatings on targets are also getting higher and higher. Correspondingly, the quality requir...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24B27/033B24B41/02B24B41/06B24B47/12B24B47/20B24B55/06
CPCB24B1/00B24B27/033B24B41/02B24B41/06B24B47/12B24B47/20B24B55/06
Inventor 王英洁文崇斌胡智向朱刘
Owner XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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