Vertical continuous PCB nickel or gold plating equipment

Abstract

The invention discloses vertical continuous PCB nickel or gold plating equipment, comprising an electric control device, a nickel plating bath, a gold plating bath, a rack, a conveying mechanism, a nickel plating pretreatment tank, a nickel plating post-treatment tank, a gold plating pretreatment tank and a gold plating post-treatment tank, wherein the conveying mechanism is arranged on the rack, and is arranged above each tank body; the electric control device controls PCB plates to be conveyed to the corresponding treatment tank to gradually immerse or lift; the length direction of the nickel plating bath is consistent with the process flow direction; the conveying mechanism is used for gradually and continuously immersing the PCB plates into the nickel plating bath; each PCB plate is soaked into the nickel plating bath under the drive of the conveying mechanism, and moves along the length direction of the nickel plating bath; anodes are respectively arranged on two side walls of the nickel plating bath; the panels of the PCB plates are opposite to the anodes; two anodes are symmetrically distributed on two sides of each PCB plate; the consistency and the uniformity of the surface coatings of different PCB plates are ensured; the subsequent continuous gold plating consistency and uniformity are improved; waste of a liquid medicine is reduced; the wastewater treatment difficulty is lowered; the environmental pollution is reduced; and the cost is also reduced.

Description

technical field [0001] The invention relates to a PCB electroplating equipment, in particular to a vertical continuous PCB nickel-plating and gold-plating equipment. Background technique [0002] In the current digital age, the sought-after PCB boards (including conventional PCBs and IC substrates) require thin, short, high-speed, high-density and multi-functional, specifically thin, thin lines, small holes, accurate dimensions, stable performance and Low cost. [0003] Electroplating gold actually refers to electroplating nickel gold. In the PCB manufacturing process, a layer of nickel is usually plated on the PCB board first to facilitate welding in the process. Plated with gold. [0004] Electroplating gold is divided into hard gold and soft gold. In the electronics industry, hard gold is generally used as the contact point on the edge of the circuit board (commonly known as gold finger), while soft gold is generally used for aluminum wire or gold wire on COB (Chip On B...

AI Technical Summary

Problems solved by technology

[0009] (1) Nickel electroplating is carried out by immersing the Teflon frame with multiple PCB boards into the nickel plating tank. The anodes are set at both ends of the nickel plating tank, and the surface of the PCB board faces the anode. The distance between the surface and the anode is different, resulting in different current densities at the positions of each PCB board, so it cannot be guaranteed that each PCB board produced will have the same electroplating effect, that is, the consistency and uniformity of the PCB boards are poor

[0010] ⑵A straight-line production process is adopted, and a robot is used to lift the PCB board into each tank of different processes for processing. During the whole process, a Teflon frame and multiple PCB boards are lifted from one of the tanks to When the next process is carried out, the subsequent Teflon frame and multiple PCB boards can be immersed in the vacated tank for processing. Therefore, each production process is not continuous, resulting in low work efficiency and low output. In addition, the PCB board Both need to be manually fixed on the Teflon frame, and manual loading and unloading are required, which cannot be fully automated and increases labor costs

[0011] ⑶ When the manipulator lifts the Teflon frame with the PCB board, due to the large volume, the amount of liquid medicine is brought out, not only the loss of nickel-gold liquid medicine is serious, but also the liquid medicine of the previous process enters the next process, which will affect the next process. In addition, it also increases the difficulty of wastewater treatment and aggravates environmental pollution

Images