Silicon wafer overturning and conveying system and method

Abstract

The invention discloses a silicon wafer overturning and conveying system and method, and belongs to the field of solar silicon wafer production. According to the silicon wafer overturning and conveying system, a feeding device comprises a feeding conveying track and a stacking mechanism, an overturning device comprises a first buffer track, an overturning mechanism and a second buffer track, and adischarging device comprises a discharging conveying track and a drainage mechanism; and the stacking mechanism is located between the feeding conveying track and the first buffer track, the overturning mechanism is located between the first buffer track and the second buffer track, and the drainage mechanism is arranged between the second buffer track and the discharging conveying track. Therefore, a plurality of silicon wafers can be stacked in a basket through the stacking mechanism and turned over in batches, the overturning mechanism can be allowed to turn over the basket at a low speedthrough the arrangement of the buffer tracks while transportation of the silicon wafers on the conveying tracks is not affected, so that the silicon wafer overturning and conveying efficiency is improved, and the safety of the silicon wafers in the overturning process is improved.

Description

technical field [0001] The invention relates to the technical field of solar energy production, and more specifically, to a silicon wafer inversion conveying system and a conveying method. Background technique [0002] In the processing and production of solar cells, with the continuous improvement of silicon wafer processing technology, the double-sided processing technology of silicon wafers is becoming more and more mature. At present, part of the process is to process the two sides of the silicon wafer step by step, which requires turning over the silicon wafer that has been processed on one side and then processing it again. At the same time, since the silicon wafers cannot be directly contacted, it is necessary to use a suction cup to manually turn the silicon wafers one by one, which results in time-consuming and labor-intensive processing and low turnover efficiency. [0003] In related fields, in order to solve the above-mentioned problems, the commonly used method...

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the low efficiency of silicon wafers in the prior art when they are turned over and conveyed, and to provide a silicon wafers turning and conveying system, which aims to use the turning mechanism to turn over the silicon wafers in the flow

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