Manufacturing equipment and manufacturing method for quartz parts for thin-walled curved semiconductors
A technology for manufacturing equipment and semiconductors, which is applied in semiconductor/solid-state device manufacturing, glass manufacturing equipment, manufacturing tools, etc. It can solve the problems of low component yield, easy wavy parts, low production efficiency, etc., and achieve lower requirements and curved surfaces. Smooth, labor-saving effect
Active Publication Date: 2021-06-22
SHANGHAI USTRON QUARTZ GLASS CO LTD
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Problems solved by technology
[0004] The present invention aims at the technical problems that the existing curved surface structure is low in production efficiency, prone to environmental pollution, prone to corrugation, and low in yield rate due to manual processing of the existing curved surface structure, and aims to provide a thin-walled Manufacturing equipment and manufacturing method of quartz component for curved surface semiconductor
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[0048] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific diagrams.
[0049] refer to Figure 1 to Figure 4, used for the manufacture of quartz components for thin-walled curved semiconductors, including a vacuum pump 1, an air tank 2, a hose 3, a hard tube 4, a movable column chuck 5, a molding device 6, an outer cavity 6-1, an inner Cavity mold 6-2, star-shaped hollow structure 6-2-1, through hole 6-2-2, semicircular blowtorch 7, typical thin-walled curved quartz part 8, typical semi-finished quartz part 9, typical quartz part semi-finished bottom plate 9-1 , Typical quartz parts semi-finished flange 9-2, fixed column chuck 10, ring blowtorch 11, rotary joint 12.
[0050] It also includes a glass lamp lathe. Two rotatable column chucks are arranged on the glass lamp lathe. The rotatable column chucks are of the exis...
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The invention belongs to the technical field of manufacturing quartz components for semiconductors, and in particular relates to a manufacturing device and a manufacturing method. Among them, the manufacturing equipment includes a glass lamp lathe. There are two rotatable column chucks on the glass lamp lathe, and a forming device is clamped on one column chuck. The forming device has a hollow structure; one side of the forming device is concave. The inner cavity is formed, and the wall of the inner cavity is provided with a through hole communicating with the hollow structure; the other end surface of the forming device is provided with a pipe threaded hole, the threaded hole communicates with the hollow structure, and the pipe threaded hole is connected to the rotary joint, and the rotary joint The gas storage tank is connected through the pipeline, and the gas storage tank is connected with the vacuum pump. Through the manufacturing equipment and manufacturing method of the present invention, the wall thickness of typical thin-walled curved quartz parts is guaranteed, there are no defects such as waves, the dependence on labor is reduced, the original requirements of the product are met after one-time molding, and the quality of the product is improved. Yield, reduced processing cycle, and processing costs.
Description
technical field [0001] The invention belongs to the technical field of manufacturing quartz components for semiconductors, and in particular relates to a manufacturing device and a manufacturing method. Background technique [0002] In the production process of semiconductor wafers, there is a special process called diffusion process, which is a doping technology, specifically doping the required impurities into the semiconductor material according to the required concentration and distribution, so as to change the electrical properties of the material , for the purpose of forming semiconductor devices. When the wafer is diffused, the equipment used requires various types of curved surface components. Due to the particularity of the product, the requirements for quartz components in the chip production process are particularly strict, including size, appearance, transmittance, and Requirements for residual particles on the surface, etc. [0003] This kind of parts with cur...
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IPC IPC(8): C03B20/00C03B23/023H01L21/22G06F30/17G06F30/20G06F113/22
CPCC03B20/00C03B23/023G06F30/17G06F30/20G06F2113/22H01L21/22Y02P40/57
Inventor 顾曹鑫吴慧明马洋洋王瑞洲
Owner SHANGHAI USTRON QUARTZ GLASS CO LTD