Power module thermal resistance testing device based on static measurement method
A power module and testing device technology, which is applied in the direction of measuring devices, measuring electricity, and measuring electrical variables, etc., can solve the problems of uneven temperature distribution on the heat dissipation surface and large test errors, and solve the problem of inaccurate shell temperature measurement and junction temperature. Instability, the effect of reducing the shell temperature test error
Pending Publication Date: 2021-01-08
BEIJING SATELLITE MFG FACTORY
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Problems solved by technology
[0004] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, the present invention can measure the thermal resistance of the power module / device with electrodes at the bottom by adopting the integrated tooling with telescopic electrodes and telescopic thermocouples, and solve the problem of Uneven temperature distribution on the heat dissipation surface at the bottom of the test device, large test errors due to the introduction of fixed thermocouples into contact thermal resistance and contact resistance, has the advantages of good repeatable measurement consistency and high measurement accuracy
Method used
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[0035] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0036] A power module thermal resistance testing device based on a static measurement method, such as figure 1 As shown, it includes a test host 10, a test connection cable 9, a liquid cooling plate 4, a pressurization device base 6, a pressurization device bracket 5, a pressurization device 2, a pressurization head 3, an integrated thermal resistance test tool 1 and a refrigeration unit. Machine 7,
[0037] The pressurizing device base 6 is a flat plate structure, and the pressurizing device support 5 is an L-shaped support; The test device provides pressure, and the pressure generated by the pressurizing device 2 is between 0 and 100N to ensure that the device is in close contact with the heat dissipation surface of the integrated thermal resistance test tool 1; the pressure head 3 does not exchange heat with the device to be tested;
[0038] The test con...
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The invention relates to a power module thermal resistance testing device based on a static measurement method. The device comprises a test host, a test connection cable, a liquid cooling plate, a pressurizing device base, a pressurizing device bracket, a pressurizing device, a pressurizing head, an integrated thermal resistance test tool and a refrigerating machine, and is characterized in that the pressurizing device base is of a flat plate structure, and the pressurizing device bracket is an L-shaped bracket; the pressurizing device is fixed at the top of the pressurizing device bracket, the pressurizing device and the pressurizing device base are vertically mounted, and the pressurizing head provides a pressure for a to-be-tested device to ensure that the device is in close contact with the heat dissipation surface of an integrated thermal resistance test tool; the pressurizing head does not exchange heat with the to-be-tested device; a test connection cable provides heating poweroutput for the to-be-tested device, collects temperature sensitive parameters of the to-be-tested device and transmits the parameters to the test host. The device has the advantages of being good in repeated measurement consistency and high in measurement precision.
Description
technical field [0001] The invention relates to a power module thermal resistance testing device based on a static measurement method, which belongs to the semiconductor testing technology. Background technique [0002] Thermal resistance is a physical concept that refers to the resistance encountered when heat flow (power) flows through a heat conductor (a temperature difference will be generated on the heat conductor). The reciprocal of thermal resistance is thermal conductance. Generally speaking, good thermal conductivity of an object means small thermal resistance. For semiconductor devices, a certain amount of power (especially power devices) must be applied during operation, and most of this power is converted into heat, which causes the temperature rise of the device chip. The heat on the chip is transferred to the housing through the chip sintering material, and further transferred to the surrounding air environment. [0003] At present, for the measurement of the...
Claims
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Login to View More IPC IPC(8): G01N25/20G01R31/26
CPCG01N25/20G01R31/2601
Inventor 飞景明张彬彬陈滔张明华陈雅容李岩郝春雨
Owner BEIJING SATELLITE MFG FACTORY