Cavity substrate with directional photoelectric transmission channel and manufacturing method thereof

Abstract

The invention discloses a cavity substrate with a directional photoelectric transmission channel, and the cavity substrate comprises a supporting frame, a first dielectric layer located on a first surface of the supporting frame, and a second dielectric layer located on a second surface of the supporting frame. The supporting frame, the first dielectric layer and the second dielectric layer form aclosed cavity with an opening in one side of the substrate in the length direction, a first circuit layer is arranged on the inner surface, facing the cavity, of the first dielectric layer, and at least one electrode connected with an optical communication device is arranged on the first circuit layer. The electrode is electrically conducted with the first circuit layer, second circuit layers arearranged on the outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer is communicated with the second circuit layer through a through hole column.The invention further discloses a manufacturing method of the cavity substrate with the directional photoelectric transmission channel.

Description

technical field [0001] The invention relates to an electronic device packaging structure, in particular to a cavity substrate with directional photoelectric transmission channels and a manufacturing method thereof. Background technique [0002] Optical fiber technology has become more and more popular, and photoelectric modules have been widely used. The current photoelectric module is mainly assembled by receiving optical sub-assembly, transmitting optical sub-assembly, optical interface, internal circuit board, heat conducting frame and shell. On the transmit side of an optoelectronic transceiver, a laser diode and associated circuitry is used to generate a modulated optical signal (representing data) that is eventually coupled into an output signal path (fiber optic, waveguide, etc.); The receiving device is assembled on the receiving side PCB, and the light receiving device is generally integrated in a metal shell by photodetectors (APD tubes or PIN tubes), preamplifier...

AI Technical Summary

Problems solved by technology

The present invention solves the problem of surface mounting of optical communication devices by providing a cavity for installing optical communication devices in the packaging substrate, and the volume after packaging can be significantly reduced compared with the prior art; the positions of the light receiving device and the light emitting device are separated, Avoid the interference of optical signals, reduce the noise of the signal; no need to install metal barrier walls, reduce process steps, and reduce manufacturing costs

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