Laser cutting device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 许同
- Publication Date
- 2021-01-15
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field
[0001] The invention relates to the technical field of laser cutting devices, in particular to a laser cutting device.Background technique
[0002] Laser cutting is to focus the laser light emitted from the laser into a high-power density laser beam through the optical path system. The laser beam irradiates the surface of the workpiece to reach the melting point or boiling point. At the same time, the high-pressure gas coaxial with the beam will melt or gas. The metal is blown away, as the relative position of the beam and the workpiece moves, the material will finally form a slit to achieve the purpose of cutting. With the continuous development of laser technology, more and more mature laser technology is applied in various fields, for example, Laser marking, laser printing, laser cutting, laser welding, laser ranging, etc. The laser has the characteristics of strong directionality, high brightness and concentrated energy.
[0003] However, in the existing laser cutting mach...