Laser repairing method of thin film

Abstract

The invention relates to the technical field of laser repairing, in particular to a laser repairing method for a thin film. According to the laser repairing method, a proper laser source is selected by acquiring an element of which the topmost absorptivity is greater than the bottommost absorptivity in the thin film and an element of which the bottommost absorptivity in the thin film is minimum inan absorptivity set, then the thin film is subjected to laser repairing treatment through the selected laser source, accumulated energy of laser on the film layer in unit time can be effectively reduced, formation of a high-heat affected zone of the bottom layer is reduced, and therefore bottom layer damage is reduced, and the repairing success probability is increased.

Description

technical field [0001] The invention relates to the technical field of laser repair, in particular to a thin film laser repair method. Background technique [0002] During the processing of thin-film transistors, dust problems can lead to graphic definition errors, or dust cover during graphic transfer in the post-processing process, resulting in abnormal final graphics and formation of defects, affecting transistor performance or signal series connection, leading to final product failure . The existing pattern repair method uses laser to locally heat and vaporize the wrong pattern to remove excess photoresist or film. There are three types of common laser light sources: IR, Green, and D-UV, each with different wavelength energy. There are three common laser pulse frequencies: Nona (E-9), Pico (E-12), and Fento (E-15). [0003] With the laser repair equipment currently on the market, the repair techniques are all easy to cause damage to the underlying material. Analysis ...

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Problems solved by technology

[0003] With the laser repair equipment currently on the market, the repair techniques are all easy to cause damage to the underlying material

Analysis of the reasons for the failure of laser repair is mainly due to the absorption and vaporization of the laser energy by the thin film, but the thin film absorbs the laser energy and transfers the energy to the underlying material in the form of heat transfer, resulting in the formation of a high heat-affected zone (Heat-affected zone); After the affected area is formed, it will cause qualitative change or melting of the underlying material, resulting in abnormal wiring and structure, resulting in repair failure

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