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High-strength, corrosion-resistant, high-thermal-conductivity, free-cutting, lead-free and environment-friendly silicon brass as well as preparation and application thereof

A high thermal conductivity, easy cutting technology, applied in the field of copper alloy preparation, can solve the problems of lead-free silicon brass difficult and easy cutting performance, dezincification corrosion resistance, high tensile plasticity, high strength and high thermal conductivity, etc., to achieve excellent comprehensive physical and chemical properties Improved performance, tensile strength and plasticity, and improved chip breaking performance

Inactive Publication Date: 2021-01-22
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent regulates the structure of silicon brass by designing alloy components and phase composition and appropriate heat treatment process, thus solving the problem that the existing lead-free silicon brass is difficult to obtain easy cutting performance, dezincification corrosion resistance and high tensile plasticity at the same time , high strength, high thermal conductivity

Method used

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  • High-strength, corrosion-resistant, high-thermal-conductivity, free-cutting, lead-free and environment-friendly silicon brass as well as preparation and application thereof
  • High-strength, corrosion-resistant, high-thermal-conductivity, free-cutting, lead-free and environment-friendly silicon brass as well as preparation and application thereof
  • High-strength, corrosion-resistant, high-thermal-conductivity, free-cutting, lead-free and environment-friendly silicon brass as well as preparation and application thereof

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Experimental program
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Effect test

Embodiment 1

[0034]1) Composition design: Design the alloy composition and phase composition based on the virtual zinc equivalent rule. The mass percentages of Cu, Zn, Si and Al alloy elements are designed to be Cu 62.10%, Zn 36.555%, Si 0.85% and Al 0.39%, respectively. After calculation The virtual zinc equivalent of the alloy is 43.3%, and the expected structure of the alloy is α+β phase; in addition, the mass percentages of Ti, B and Re in the alloy are designed to be Ti 0.05%, B 0.005% and Re0.05 %;

[0035] 2) Preparation of materials or parts: first add pure silicon and electrolytic copper into the intermediate frequency induction furnace, and keep it at 1100°C for 20 minutes to completely melt it; then lower the furnace temperature to 800°C, then add pure aluminum and pure zinc, and hold it for 10 minutes; Raise the furnace temperature to 1100°C, add copper-titanium, aluminum-boron intermediate alloy and rare earth, keep it warm for 30 minutes, and then cast it into lead-free silic...

Embodiment 2

[0039] 1) Composition design: Design the alloy composition and phase composition based on the virtual zinc equivalent rule. The mass percentages of Cu, Zn, Si and Al alloy elements are designed to be Cu 59.155%, Zn 39.68%, Si 0.77% and Al 0.29%, respectively. After calculation The virtual zinc equivalent of the obtained alloy is 45.4%, and the expected structure of the alloy is α+β phase; in addition, the mass percentages of Ti, B and Re in the alloy are designed to be Ti 0.05%, B 0.005% and Re 0.05% respectively ;

[0040] 2) Preparation of materials or parts: first add pure silicon and electrolytic copper into the melting furnace of low-pressure casting equipment, keep it at 1150°C for 15 minutes to completely melt it; then lower the furnace temperature to 850°C, then add pure aluminum and pure zinc, keep warm 5min; raise the furnace temperature to 1150°C, add copper-titanium, aluminum-boron intermediate alloy and rare earth, keep warm for 10min, and then low pressure cast i...

Embodiment 3

[0044] 1) Composition design: Design the alloy composition and phase composition based on the virtual zinc equivalent rule. The mass percentages of Cu, Zn, Si and Al alloy elements are designed to be Cu 57.66%, Zn 40.484%, Si 1.26% and Al 0.50%, respectively. After calculation The virtual zinc equivalent of the alloy is 49.3%, and the expected structure of the alloy is β+γ phase; in addition, the mass percentages of Ti, B and Re in the alloy are designed to be Ti 0.03%, B 0.006% and Re 0.06% respectively ;

[0045] 2) Preparation of materials or parts: firstly add pure silicon and electrolytic copper into the intermediate frequency induction furnace, and keep it at 1130°C for 18 minutes to completely melt it; then lower the furnace temperature to 830°C, then add pure aluminum and pure zinc, and hold it for 8 minutes; Raise the furnace temperature to 1130°C, add copper-titanium, aluminum-boron intermediate alloy and rare earth, keep it warm for 20 minutes, and then cast it into...

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Abstract

The invention discloses high-strength, corrosion-resistant, high-thermal-conductivity, free-cutting, lead-free and environment-friendly silicon brass as well as preparation and application thereof. The lead-free silicon brass comprises the following elements in percentage by mass: 56%-64% of Cu, 35%-42% of Zn, 0.2%-1.5% of Al, 0.5%-1.5% of Si, 0.03%-0.06% of Ti, 0.003%-0.01% of B and 0.03%-0.06% of Re; the preparation process comprises the three procedures of component design, material or part preparation and heat treatment, especially the heat treatment process comprises 600+ / -50 DEG C solidsolution treatment and 230+ / -20 DEG C aging treatment; the microstructure of the lead-free silicon brass is that an alpha phase or gamma phase or intermetallic compound of 200-500 nm is dispersed anddistributed on a beta phase matrix, so that the lead-free silicon brass alloy has excellent comprehensive physical and chemical properties such as excellent mechanical property, free cutting property,high corrosion resistance and high thermal conductivity.

Description

technical field [0001] The invention belongs to the technical field of copper alloy preparation, and in particular relates to a high-strength, corrosion-resistant, high-thermal conductivity, easy-to-cut, lead-free, environmentally friendly silicon brass and its preparation and application. Background technique [0002] As an important engineering material, brass is widely used in various fields such as water heater valves, bathroom main body and accessories, air conditioning valves, communication link hardware accessories, household hardware, radiators, electronic instruments, low temperature pipelines, aerospace, ships, etc. . Generally, 1-3% lead is added to brass to improve its cutting performance. Lead rarely dissolves in the Cu-Zn matrix, and is dispersed in the alloy matrix as an independent phase. Lead particles with soft quality and low melting point are like holes in the matrix, which is prone to stress concentration during cutting, causing chips to break in a bro...

Claims

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Application Information

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IPC IPC(8): C22C9/04C22C1/03C22F1/08
CPCC22C1/03C22C9/04C22F1/08
Inventor 杨超陶鲭驰丁言飞张卫文李元元
Owner SOUTH CHINA UNIV OF TECH
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