Printed circuit board heat exchanger core for reducing stress
A technology for printed circuit boards and heat exchangers, applied in printed circuits, printed circuit components, circuit thermal devices, etc., can solve the problems of core scrap, excessive plastic deformation, material failure, etc., to eliminate sharp corners, reduce Thermal and mechanical stress, volume reduction effect
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[0027]The present invention will be further described in detail below in conjunction with the embodiments.
[0028]Such asFigure 2a withFigure 2b As shown, the present invention provides a printed circuit board heat exchanger core for reducing stress. The core includes a plurality of hot plates 3'with hot fluid (high temperature fluid) channels 1'and a cold fluid (Cryogenic fluid) Cold plate 4'of channel 2'. The hot fluid (high temperature fluid) channel 1'and the cold fluid (low temperature fluid) channel 2'adopt a photochemical etching method to etch micro-channels with a semicircular cross-section on the metal plate, and the shape of the channel along the flow direction can be straight or positive. ) String, Z (Zigzag) or other combination forms, the etched metal plates constitute the hot plate 3'and the cold plate 4'.
[0029]Such asimage 3 As shown, the hot plate 3'and the cold plate 4'both have a surface A and a plane B with a semi-circular arc. The hot plate 3'and the cold plate 4'...
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