Printed circuit board heat exchanger core for reducing stress

Abstract

The invention discloses a printed circuit board heat exchanger core for reducing stress. The printed circuit board heat exchanger core comprises a plurality of hot plates with hot fluid channels and cold plates with cold fluid channels, wherein the upper surfaces and the lower surfaces of the hot plate sheets and the cold plate sheets are respectively provided with a surface A with a semi-arc anda plane B with a semi-arc, and the surface A with the semi-arc and the surface A with the semi-arc are symmetrically connected to form a circular section channel; and the planes B are connected to form a wall surface between the cold fluid channel and the hot fluid channel. The stress borne by the core body can be greatly reduced, the size of the core body can also be reduced, the structure of theheat exchanger is more compact, and higher pressure and higher temperature can be borne.

Description

technical field [0001] The invention relates to the technical field of heat exchange devices, in particular to a printed circuit board heat exchanger core for reducing stress. Background technique [0002] Printed circuit heat exchanger (PCHE) is widely used in chemical industry, aerospace, petroleum, electric power, refrigeration and many other fields due to its compact structure, high temperature and high pressure resistance, and large heat transfer per unit volume. As the core component of the printed circuit board heat exchanger, the core body provides a place for hot and cold (low temperature, high temperature) fluid to flow and exchange heat, and bears the high temperature and high pressure of the heat exchange fluid. In the industry, photochemical etching is usually used to etch semicircular microchannels with an equivalent diameter of about 1 mm on the metal plate to form a cold and hot plate, and then the hot and cold plates are sequentially connected by diffusion w...

AI Technical Summary

Problems solved by technology

Especially at the connection between the semicircular channel of the next layer of plates and the bottom of the upper plate, the arc and diameter of the semicircle constitute two sharp corners that lead to stress concentration, such as figure 1 As shown, although there will be a small arc transition at the sharp corner during diffusion welding, the mechanical stress and thermal stress at the sharp corner are still much greater than those at other positions, which can easily cause local excessive plastic deformation, resulting in material failure and core body scrapping

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