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Wafer coating detection equipment for electronic commerce control chip

A technology for controlling chips and e-commerce, applied to circuits, coatings, electrical components, etc., can solve problems such as time-consuming and labor-intensive, and achieve the effect of accelerated cooling

Inactive Publication Date: 2021-01-29
义乌春绘贸易有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] After understanding the coating work of the existing wafer coating equipment, it is found that the amount of the coating film and the weight of the wafer cannot achieve the effect of self-adaptation, so when the weight of the wafer changes, the amount of epoxy resin sprayed It is time-consuming and labor-intensive to re-adjust the spraying equipment manually, so a wafer coating detection equipment for e-commerce control chips came into being

Method used

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  • Wafer coating detection equipment for electronic commerce control chip
  • Wafer coating detection equipment for electronic commerce control chip
  • Wafer coating detection equipment for electronic commerce control chip

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1-4 , a wafer coating detection device for e-commerce control chips, comprising a conveyor belt 1, an elastic plate 2 is movably connected to the bottom of the conveyor belt 1, and a push rod 15 is movably connected to the inside of the elastic plate 2 and the surface of the arc-shaped cover 4; The surface of the push rod 15 is movably connected with the auxiliary plate 16, and the inside of the auxiliary plate 16 is movably connected with t...

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Abstract

The invention relates to the technical field of electronic commerce wafer coating, and discloses wafer coating detection equipment for an electronic commerce control chip. The wafer coating detectionequipment comprises a conveyor belt, wherein an elastic plate is movably connected to the bottom of the conveyor belt, a support rod is movably connected to one side of the elastic plate, an arc-shaped cover is movably connected to the interior of the elastic plate and located at the bottom of the conveyor belt, an expansion frame is movably arranged in the arc-shaped cover, an air storage bag ismovably connected to the surface of the expansion frame, rollers are movably connected to the left and right ends of the expansion frame, a homogenizing layer is fixedly connected to the bottom of theconveying belt and located on the surface of the expansion frame, and liquid storage pipes are fixedly connected to the left and right sides of an airflow groove. Part of air flowing out of the air storage bag flows out of an air flow groove, the other part of the air flows to the surface of a sliding plate,so that the sliding plate can be blown to extrude epoxy resin in the liquid storage pipe to be sprayed out of a guide nozzle, the driving force of the sliding plate extruding the epoxy resin is the weight of a wafer, and therefore, the effect that the coating amount is matched with the weight of the wafer is achieved.

Description

technical field [0001] The invention relates to the technical field of e-commerce wafer coating, in particular to a wafer coating detection device for an e-commerce control chip. Background technique [0002] E-commerce is a system based on the operation of electronic components, and the more important part of electronic components is the wafer. The wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. The original material is silicon, and now Some wafers need to be coated before they can be installed on chips for use, so people have developed wafer coating equipment. [0003] After understanding the coating work of the existing wafer coating equipment, it is found that the amount of the coating film and the weight of the wafer cannot achieve the effect of self-adaptation, so when the weight of the wafer changes, the amount of epoxy resin sprayed It is time-consuming and labor-intensive to manually re-adjust the spraying equipment, so a w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B16/20B05B13/02B05B12/12B05D3/04H01L21/67
CPCB05B12/122B05B13/0221B05D3/0406B05B16/20H01L21/67017H01L21/6715H01L21/67253
Inventor 潘发
Owner 义乌春绘贸易有限责任公司
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