Wafer sorting equipment and wafer sorting method

Abstract

The invention provides wafer sorting equipment and a wafer sorting method. The equipment comprises a sorting chamber, wherein the sorting chamber comprises a first layer chamber and a second layer chamber, a first discharging port is formed in the discharging end of the first layer chamber, and a first conveying belt is arranged in the first layer chamber, a second discharging port is formed in the discharging end of the second layer chamber, and a second conveying belt is arranged in the second layer chamber, a filtering fan unit is arranged above the sorting chamber; and a calibrator unit, wherein the calibrator unit is located at the feeding end of the sorting chamber, the calibrator unit is at least provided with a first feeding port and a second feeding port, at least two mechanical arms are arranged in the calibrator unit, a first mechanical arm is used for transferring OK wafers from the first feeding port to the first conveying belt of the first layer chamber, and a second mechanical arm is used for transferring NG wafers from the second feeding port to the second conveying belt of the second layer chamber. According to the wafer sorting equipment and the wafer sorting method, the environment cleanliness during wafer sorting can be improved, the pollution risk is reduced, and the efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production and manufacturing, in particular to a wafer sorting device and a wafer sorting method. Background technique [0002] With the rapid development of semiconductors, the requirements for the cleanliness of wafers are getting higher and higher. As the sorting equipment for wafers before shipment, the cleanliness of ShippingCompiler is particularly important. Some originally OK (qualified) wafers will also have abnormal conditions such as contamination due to wafer sorting equipment. [0003] In the related art, the main structure of the wafer sorting equipment is as follows: the equipment includes a sorting chamber, an Aligner (aligner) mechanism is provided at one end of the sorting chamber, and the front and rear sides of the sorting chamber are respectively provided with The Load port (upper port) and the Unload port (lower port) of the wafer are equipped with a robot and a mechan...

AI Technical Summary

Problems solved by technology

[0005] 1) When the equipment is in sorting operation, the internal robot and mechanical arm are constantly moving, and each movement will inevitably generate eddy currents, which will lead to increased turbulent flow, which will cause particles in the equipment to fall on the crystal Above the circle, it affects the product quality, so it is necessary to reduce the moving speed of the robot and the mechanical arm, but this will affect the production capacity of the equipment;

[0006] 2) The currently used wafer sorting equipment is a single-layer structure, and the efficiency of the equipment is low;

[0007] 3) Both OK wafers (qualified wafers) and NG wafers (unqualified wafers) in the sorting chamber are sorted in the same chamber environment, contacting the same robotic arm, there is a risk of cross-contamination;

[0008] 4) Currently used wafer sorting equipment usually has 8 to 10 ports (loading and unloading ports), the equipment space is large, and the production line occupies a large area. At the same time, it is necessary to ensure that the cleanliness of such a large area has never been problem, difficult

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