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Application of a kind of metallophobic material

A metal material and metal technology, applied in the field of metal sparse materials and their applications, can solve the problems of high production cost, limited application, large surface tension of liquid metal, etc., and achieve the goal of reducing production cost, expanding application range and improving production efficiency Effect

Active Publication Date: 2022-05-31
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface tension of liquid metal is extremely high. At present, liquid metal patterns can only be formed on a small number of substrates by direct printing, but cannot be printed directly, which makes the production efficiency of liquid metal patterns low, high production cost, and limited applications.

Method used

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  • Application of a kind of metallophobic material
  • Application of a kind of metallophobic material
  • Application of a kind of metallophobic material

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0072]

[0073] The preset temperature of the above-mentioned metal-phobic material is 120 degrees Celsius.

example 2

[0076]

[0077] The preset temperature of the above-mentioned metal-phobic material is 140 degrees Celsius.

example 3

[0080]

[0081]

[0082] The preset temperature of the above-mentioned metal-phobic material is 146 degrees Celsius.

[0086] Step S1, providing a substrate, the substrate can adhere to the liquid metal.

[0087] The substrate may include: paper, cloth, metal, plastic, glass, wood, rubber, thermoplastic elastomer, silicone film.

[0088] Step S2, on the substrate, use the metal sparse material described in any one of the above to form a sparse metal pattern.

[0090] In step S3, the metallophobic pattern is cured, so that the substrate has selectivity to the liquid metal.

[0097] Exemplarily, by weight percentage, the above-mentioned metal-philic material includes 10% to 80% of the resin resin film-forming product,

[0098] The metal-philic functional powder includes: one or more of silicon dioxide, silicon aerogel, talc, and light calcium carbonate.

[0106] The release paper layer 6, the release paper layer 6 is located on the side of the primer layer 5 away from the antenna lay...

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Abstract

The invention provides a metallophobic material and its application, and relates to the technical field of liquid metal. In terms of weight percentage, the metallophobic material provided by the present invention includes 10% to 50% of resin film formers, 10% to 40% of metallophobic functional powders, and 10% to 50% of solvents; In some cases, the metallophobic material is separated from the liquid metal, and the liquid metal is a metal element or alloy with a melting point below 300° C., or a conductive fluid mainly composed of the above metal element or alloy. The technical solution of the invention can realize direct printing of liquid metal, thereby improving the production efficiency of liquid metal patterns, reducing production costs, and helping to expand the application range of liquid metal.

Description

Application of a metal-phobic material technical field The present invention relates to liquid metal technical field, relate in particular to a kind of sparse metal material and application thereof. Background technique In the traditional electronic printing field, the preparation of electronic circuits often requires complicated processes, and the The process is accompanied by waste of resources and environmental pollution. For example, the copper plate etching process in the traditional circuit preparation method requires prior Metal copper is plated on the circuit substrate (usually glass fiber board), and then removed by chemical etching or laser engraving. In addition to the excess metal copper, a copper circuit of a specific shape is finally formed on the surface of the substrate. This preparation process takes a long time, The process is complex, and the requirements for manufacturing instruments are relatively high. In today's society, people's demand for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/106C09D11/104C09D11/03C09D127/06C09D167/00C09D7/61H05K1/09H05K3/12
CPCC09D11/106C09D11/104C09D11/03C09D127/06C09D167/00C09D7/61H05K1/092H05K3/12H05K3/1208C08K3/34C08K3/346Y02P10/25
Inventor 董仕晋郑翰
Owner BEIJING DREAM INK TECH CO LTD