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Probe Sockets and Probe Assemblies

A probe and plug-in technology, which is applied in the field of probe sockets and probe components, can solve the problems of reduced probe sensitivity, large test error, and large resistance change, achieving constant contact resistance, ensuring sensitivity, and avoiding wear effect

Active Publication Date: 2021-04-27
FTDEVICE TECH (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) When the metal probe is in contact with the surface of the substrate to be tested under the action of force, the force will cause mutual indentation at the contact point, thereby reducing the sensitivity of the probe and forming scratches on the circuit board;
[0005] (2) There is slippage between the point to be measured and the probe during contact, resulting in unstable contact and large resistance changes, resulting in larger test errors

Method used

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  • Probe Sockets and Probe Assemblies
  • Probe Sockets and Probe Assemblies
  • Probe Sockets and Probe Assemblies

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A probe assembly in this embodiment includes a probe 1 , a probe socket 2 and a support frame 3 .

[0036] The probe 1 is arranged in the probe socket 2, and the probe socket 2 is fixed between the object 4 to be measured and the test member 5 through the support frame 3, and the lower end surface of the object 4 to be measured is connected to the first column end of the probe 1. 1-3 are electrically connected, and the second column end of the probe 1 is electrically connected with the test member 5 through the conductive fluid in the liquid holding tube 2-6-2.

[0037] The probe socket 2 can be detachably installed on the support frame 3, and the displacement of the support frame 3 is controlled by the driver to adjust the position of the probe socket 2. At the same time, the probe socket can be fixed, and the object to be measured 4 is set on It can be adjusted and fixed on the instrument to meet the fixation and movement of the object 4 to be measured.

[0038] When t...

Embodiment 2

[0050] A probe socket disclosed in this embodiment includes: an upper unit 2-1, a spacer 2-2, a first cover 2-3, a lower unit 2-4, a second cover 2-5, a connection pieces 2-6.

[0051] Both the upper unit 2-1 and the lower unit 2-4 are square tubes with cuboid cavities inside to fully adapt to the shape of the columnar tube 1-1. The columnar tube 1-1 is square.

[0052] The upper unit 2-1 is provided with a spacer 2-2 inside, and the top of the upper unit 2-1 is provided with a first cover plate 2-3, and the lower port of the upper unit 2-1 is docked with the upper port of the lower unit 2-4 Forms the body of the complete probe socket. The lower end of the lower unit 2-4 is provided with a second cover plate 2-5, and the lower end of the second cover plate 2-5 is provided with a connecting piece 2-6.

[0053] The probe 1 is assembled in a cylindrical tube 1-1, and the cylindrical tube 1-1 is stably arranged in the probe socket through a positioning ring 1-2. Corresponding g...

Embodiment 3

[0061] A test method for probe components such as Figure 4 shown, including the following steps;

[0062] Step a, the point to be measured, select the electrical contact 4-1 to be measured on the object 4 to be measured for marking;

[0063] Step b, forming a closed circuit, align the funnel-shaped nozzle 1-10 with the electrical contact 4-1 to be tested by fine-tuning the support frame 3 of the probe socket, and at the same time align the sealing ring 1-11 with the bottom of the object 4 to be tested. The surface is fully attached, and the wiring board 5-2 is pushed upward by the driver, so that the lower end of the second column end 1-5 is completely against the welding pad 5-3, and reaches the upper end of the liquid holding tube 2-6-1 Abut against the lower end surface of the second cover plate 2-5, so that the lower end of the liquid holding pipe 2-6-1 and the upper end surface of the welding pad 5-3 form a closed space, so that the liquid injection forms a preliminary ...

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Abstract

The invention discloses a probe socket and a probe assembly. The body of the probe socket includes: a first end opposite to an object to be tested and a second end opposite to a test member; the probe socket also includes: A connecting piece on the second end and in elastic contact with the test member; the connecting piece includes: a liquid holding tube arranged coaxially with the body, and an elastic column elastically supporting the liquid holding tube at the second end; the liquid holding tube includes: directly Collision to the lower nozzle of the surface of the test member; the liquid tube passes through the elastic column to maintain the contact strength between the lower nozzle and the test member; one column end of the probe passes through the second end and extends into the liquid tube until it touches the test member The welding pad on the component; one end of the liquid storage tube is inserted into the cavity of the body from the first end, and the other end of the liquid storage tube is in contact with the object to be measured to form a seam seal; a metal piston is expanded in the liquid storage tube. The invention effectively protects the object to be measured and the probe, and at the same time satisfies the requirement of more accurate and effective measurement.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a probe socket and a probe assembly. Background technique [0002] Semiconductor devices that undergo complex processes are subjected to various types of electrical tests to test their characteristics and their defects. For this purpose, the metal wires or contact pads mounted on the test board (printed circuit board) inside the test equipment and the external contacts of the device under test (semiconductor package) are electrically connected by means of sockets and probes. [0003] For example, the Chinese invention patent "Test Probe Module and Test Socket", the application number is 201880068269.X, a test probe module. Including: a conductive tube; a probe, which is inserted into the tube in a non-contact manner and elastically stretchable along the length direction; and an insulating probe support member, configured to support the probe between the inner wall of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26G01R1/067G01R1/04
CPCG01R1/0408G01R1/06711G01R31/2601G01R31/2637
Inventor 金永斌贺涛丁宁朱伟
Owner FTDEVICE TECH (SUZHOU) CO LTD
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