Flexible circuit integrated printing and packaging method based on liquid metal

A liquid metal, flexible circuit technology, applied in printed circuits, printed circuit manufacturing, and assembling printed circuits with electrical components. Complex and other problems, to achieve the effect of complete liquid metal wire, good stretching ability, simple and efficient steps

Active Publication Date: 2021-02-05
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In summary, the disclosed liquid metal-based flexible circuit manufacturing process has the following disadvantages: (1) The liquid metal wire manufacturing process is complicated, requiring photolithography, transfer printing or investment casting processes; (2) the flexible circuit substrate The packaging process is complex and requires multiple processes or stations

Method used

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  • Flexible circuit integrated printing and packaging method based on liquid metal
  • Flexible circuit integrated printing and packaging method based on liquid metal
  • Flexible circuit integrated printing and packaging method based on liquid metal

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0022] In the description of this application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying Refe...

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Abstract

The invention discloses a flexible circuit integrated printing and packaging method based on liquid metal, and the method comprises the steps of firstly printing a circuit substrate at a lower curingtemperature, carrying out in-situ high-temperature curing on the circuit substrate, printing a liquid metal wire on the surface of the cured circuit substrate after the circuit substrate is convertedinto a solid state from a liquid state in a short time; after printing is finished, placing electronic components, then printing the packaging layer at a lower curing temperature, and after the packaging layer is printed, carrying out high-temperature curing to form the final flexible circuit. The method is simple and efficient in steps, and the prepared flexible circuit liquid metal wire is complete and has good tensile capacity.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, in particular to an integrated printing and packaging method for flexible circuits based on liquid metal. Background technique [0002] Flexible electronics have broad applications in fields such as human health monitoring, wearable electronics, and robotics. Gallium-based liquid metals are widely used in the flexible electronics industry because they have the fluidity of liquids and the conductivity of metals. Invention patent "Laser-induced liquid metal transfer circuit, preparation method and flexible pressure sensor" (application number 202010170222.3), using femtosecond lasers to induce the formation of a certain pattern of micro-nano structures on the PDMS surface, changing the adhesion of the PDMS surface, and using it to selectively The liquid metal is transferred, and then encapsulated with PDMS film to obtain a laser-induced liquid metal transfer circuit composed of liquid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/30
CPCH05K3/12H05K3/1283H05K3/30H05K2203/1305
Inventor 王飞郭琪兰红波张广明马圣旺杨建军朱晓阳彭子龙郭鹏飞
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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