Flexible copper clad laminate and method for preparing same

A flexible copper clad laminate, non-conductive technology, applied in the field of flexible copper clad laminate and its preparation, can solve the problems of base film thermal damage, adjustment of target space and position, conductive film defects, etc.

Pending Publication Date: 2021-02-12
TORAY ADVANCED MATERIALS KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flexible copper clad laminate prepared by the sputtering process will cause defects on the surface of the conductive film, and it is difficult to adjust the space and position of the target in the working space and process
In addition, since the sputtering process operates at high temperature, thermal damage to the base film, etc. may occur, and the production speed will decrease

Method used

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  • Flexible copper clad laminate and method for preparing same
  • Flexible copper clad laminate and method for preparing same
  • Flexible copper clad laminate and method for preparing same

Examples

Experimental program
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preparation example Construction

[0105]

[0106] According to an embodiment of the present invention, a method for preparing a flexible copper-clad laminate may include: preparing a non-conductive polymer substrate; coating and drying a polymer-containing substrate on at least one side of the non-conductive polymer substrate; coating solution to form a polymer-containing adhesive layer; form a nickel-containing electroless plating layer on one side of the polymer-containing adhesive layer; and form a metal electrolytic plating layer on one side of the nickel-containing electroless plating layer to prepare the The flexible copper clad laminate.

[0107] The step of preparing the non-conductive polymer substrate may further include a drying step for removing moisture and residual gas from the non-conductive polymer substrate.

[0108] For example, the drying step may be performed at 50°C to 300°C, eg, 60°C to 280°C or 70°C to 270°C using an infrared (IR) heater in a vacuum atmosphere. This has the effect of ...

Embodiment 1

[0120] Example 1: Flexible copper clad laminate

[0121] As the non-conductive polymer substrate, a polyimide film (Kapton 100ENC, manufactured by TDC Corporation) having a thickness of 25 μm was used. On both sides of the polyimide film substrate, use a roll-to-roll coating device to coat polysiloxane resin (CovaBond P100, prepared by Atotech Company) and methyl ethyl ketone solvent containing amine groups at the end. The coating liquids were mixed in a weight ratio of 50:50, and dried with hot air at about 120° C. to form polysiloxane resin-containing polymer-containing adhesive layers having amino groups at their terminals with a thickness of about 20 nm. A nickel plating layer having a thickness of about 2 μm was formed on the polysiloxane resin polymer-containing adhesive layers having amino groups at their terminals, respectively, by a nickel electroless plating method performed in a horizontal direction using the nickel electroless plating solution described below. B...

Embodiment 2

[0132] Example 2: Flexible copper clad laminate

[0133] Except on both sides of the polyimide film base material, the polysiloxane resin (CovaBond P100, manufactured by Atotech Co. A coating solution in which solvents are mixed in a weight ratio of 40:60 but not in a weight ratio of 50:50, and dried with hot air at about 120°C to form polysiloxane resins containing amino groups at their ends with a thickness of about 20 nm A flexible copper-clad laminate was prepared in the same manner as in Example 1 except for the polymer-containing adhesive layer.

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Abstract

A flexible copper clad laminate and a method for producing same are disclosed. The flexible copper clad laminate comprises: a non-conductive polymer substrate; a polymer-containing adhesive layer positioned on at least one surface of the non-conductive polymer substrate; a nickel-containing plating layer positioned on one surface of the polymer-containing adhesive layer; and a metal plating layerpositioned on one surface of the nickel-containing plating layer.

Description

technical field [0001] The invention relates to a flexible copper clad laminate and a preparation method thereof. Background technique [0002] In recent years, with the development of the field of semiconductor integrated circuits, the demand for miniaturization, light weight, durability and high definition has generally increased. This is facilitating the development of materials that enable high levels of integration. For example, flexible copper clad laminates (FCCL, Flexible Copper Clad Laminate) used in LCD driver ICs are also required to have fine patterns, thin films, and durability. [0003] In order to prepare such flexible copper clad laminates, a sputtering process has recently been widely used. The sputtering process is easy to correspond to fine pitch, and the thickness can be adjusted in micro units. However, the flexible copper clad laminate prepared by the sputtering process will cause defects on the surface of the conductive film, and it is difficult to ...

Claims

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Application Information

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IPC IPC(8): C23C18/16C23C18/20C23C18/32C25D3/38C09J167/00C09J175/04C09J133/00C09J183/04C09J163/00
CPCC09J133/00C09J163/00C09J167/00C09J175/04C09J183/04C23C18/16C23C18/20C23C18/32C25D3/38C23C18/1653C23C18/1641
Inventor 李龙镐丁愚得李秉国李廷德
Owner TORAY ADVANCED MATERIALS KOREA
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