Cu-Ni-Si copper alloy plate with excellent deep-draw characteristics and production method thereof

Abstract

Provided is a copper-nickel-silicon (Cu-Ni-Si) copper alloy that strikes a balance between deep-draw characteristics, thermal ablation resistance plating and spring deflection limit and, in particular, is used in electric and electronic members that have excellent deep-draw characteristics and a Cu-Ni-Si copper alloy production method. The disclosed Cu-Ni-Si copper alloy contains 1.0-3.0 mass% Ni and Si that is 1 / 4 the density of the Ni and the remainder consists of copper and inevitable impurities. Crystal grains within the alloy structure have an aspect ratio (crystal grain minor axis / crystal grain major axis) with an average value of 0.4-0.6. The average value for the grain orientation spread (GOS) of whole crystal grains, measured by electron backscatter diffraction (EBSD) using a scanning electron microscope with an attached backscattered electron imaging system, is 1.2-1.5 DEG . The ratio (Ls / L) of the total specific grain boundary length (Ls) of the specific grain boundaries to the total grain boundary length (L) of the crystal grains is 60-70 %. The spring deflection limit is 450-600 N / mm2. At 150 DEG C and after 1000 hours, the solder had excellent deep draw characteristics and good thermal ablation resistance.

Description

technical field [0001] The present invention relates to a Cu-Ni-Si-based copper alloy that has a balance between deep drawability, solder heat peeling resistance, and elastic limit value, and in particular has excellent deep drawability and is suitable for use in electric and electronic components panels and methods of manufacture. Background technique [0002] In recent years, with the thinner and lighter electronic equipment, the miniaturization and thinner of terminals, connectors, etc. have also been developed. Therefore, strength and bending workability are required for them, and they can replace the conventional solid solution such as phosphor bronze or brass. Reinforced copper alloys, copper-nickel-silicon (Cu-Ni-Si-based) alloys, beryllium copper, and titanium copper are in increasing demand for precipitation-strengthened copper alloys. [0003] Among them, copper-nickel-silicon alloy is an alloy in which the solid solution limit of nickel-silicon compound to copper...

AI Technical Summary

Problems solved by technology

[0012] Most of the conventional Cu-Ni-Si-based copper-nickel-silicon alloys have insufficient deep drawing workability. In addition, the balance between deep drawing workability, solder heat peeling resistance, and elastic limit value is not good. Obstacles in the application of raw materials for electronic components in harsh environments with high temperature and high vibration for a long time

Images