86 results about "Electron backscatter diffraction" patented technology

The invention discloses a composite material performance prediction method based on multi-field coupling multi-scale analysis and a knowledge graph, which integrates microstructure modeling, graph neural network representation learning, cross-scale parameter coupling modeling and robust optimization analysis. The method is suitable for prediction and design of key mechanical properties such as modulus, strength and toughness of a thermosetting / thermoplastic composite material under different working conditions. The method comprises the following steps: firstly, constructing a grain-level tissue knowledge graph based on an electron backscatter diffraction image, secondly, constructing a multi-scale input system comprising a microscopic variable (such as a fiber volume fraction), a mesoscopic variable (such as a layer thickness sequence) and a macroscopic variable (such as a load condition), and finally, performing robust optimization by utilizing a multi-objective evolutionary algorithm to obtain a multi-scale input system. And outputting a material performance prediction result and a knowledge graph associated with the ji structure-process-performance. According to the method, the accuracy and interpretability of performance prediction of the composite material can be remarkably improved, and data-knowledge dual-drive support is provided for design optimization of the high-performance composite material.

The invention discloses a multi-scale simulation method for a thermal compression deformation behavior of TC4 titanium alloy, and belongs to the field of metal material processing simulation. Comprising the following steps: 1, carrying out thermal compression experiments at different temperatures to obtain a deformed sample; 2, analyzing the grain orientation, orientation difference angle and texture evolution of the sample by using an electron back scattering diffraction technology; 3, constructing a crystal plasticity finite element model, and simulating a polycrystalline deformation process; 4, constructing a molecular dynamics model, and simulating phase change and dislocation evolution in thermal compression and cooling processes; and 5, based on a multi-scale simulation result, hot working parameters are optimized, dynamic recrystallization and a beta-to-alpha phase change path are regulated and controlled, and grain refinement and performance homogenization are achieved. The invention discloses a correlation mechanism of the microstructure and the mechanical property in TC4 titanium alloy thermal compression deformation, and provides a theoretical basis for optimization of a thermal processing technology of a high-performance titanium alloy component in the aerospace field.

The invention relates to a crystal orientation detection system, which comprises an LED surface type array, an illumination lens, a reflector, a microscope objective, a sample stage, a tube lens, an image sensor and a computer, and is characterized in that the LED surface type array comprises m * n LED light sources which are uniformly distributed along the radial direction and the annular direction and are independently controlled by the computer; the illumination lens, the reflector and the microscope objective form an illumination light path, the microscope objective and the tube lens form a microscopic imaging light path, the reflector refracts an illumination light beam to the microscope objective at an inclination angle of 45 degrees, and the computer synchronously controls gating of the LED face type array and image acquisition of the image sensor. According to the technical scheme, the LED light source is long in service life and low in energy consumption, a complex vacuum environment and high-voltage equipment are not needed, optical assemblies such as a reflecting mirror, a microobjective and a tube mirror are mature and easy to obtain, and the overall manufacturing cost of the system is only 10%-20% of that of an electron backscatter diffractometer (EBSD) which is the most commonly used crystal orientation detection device at present.

The invention discloses a twin crystal nucleation position and variant selection prediction method based on machine learning, and belongs to the crossing field of material science and machine learning. The method comprises the following steps: acquiring microscopic structure data of a deformation material through electron back scattering diffraction, and constructing a multi-dimensional data set containing crystal grain parameters, crystal boundary parameters and deformation mechanism parameters by taking crystal grains and a certain crystal boundary combination as an analysis unit; and then modeling and predicting the twin crystal nucleation position and variant selection respectively by adopting a hierarchical machine learning modeling strategy. According to the method, the twinning behavior in the polycrystalline material can be efficiently and accurately predicted, and theoretical support and a technical path are provided for high-performance metal material design and plastic deformation mechanism research.

The invention discloses a residual creep life prediction method based on microscopic damage characteristics. The residual creep life prediction method comprises the following steps: acquiring interrupt samples in different damage states through a creep interrupt test; quantitatively characterizing the grain boundary orientation difference and the geometric necessary dislocation density of the interrupted sample by using an electron back scattering diffraction technology; a quantitative damage index is constructed based on the grain boundary orientation difference and the geometric necessary dislocation density, the quantitative damage index is used as an internal variable to be coupled into a Marson-Miller parameter model, and a microscopic-macroscopic associated residual life prediction model is established; and through a microscopic-macroscopic associated residual life prediction model, predicting the residual life of the material under different service times to obtain the residual creep life. According to the method, the microscopic damage state in the material can be directly and quantitatively reflected, early, sensitive and accurate prediction of the residual creep life of the in-service component is realized, and a reliable basis is provided for safe operation and maintenance decision of an overdue service unit of a power plant.

One embodiment of this disclosure provides a copper foil comprising a copper film having a matte surface and a glossy surface; and a protective layer disposed on the copper film; wherein, when a boundary with an orientation difference of 5° or greater between adjacent pixels is considered a grain boundary, the area ratio of grains (including twins) with a room temperature GOS value of 0° to less than 2° is 45% to 95% of the total cross-sectional area. The room temperature GOS value is measured on the cross-section of the copper foil at room temperature using an electron backscatter diffraction (EBSD) pattern analyzer.

The application discloses a kind of second generation nickel-based single crystal superalloy recrystallization defect simulation and control method.The method steps are: according to sample preparation wax mold, after sand blasting, dry baking, manufacture ceramic shell;Through directional solidification preparation second generation nickel-based single crystal superalloy sample, control pulling speed, holding temperature and temperature gradient and other parameters;According to service condition preparation sample, simulate stress loading, in combination with heat treatment simulate actual service environment;Using electron backscattering diffraction and X-CT imaging, characterize recrystallization grain orientation distribution, three-dimensional morphology, content and thickness.Process parameter-defect characteristic mapping relationship is established, the stress distribution characteristics during preparation are clarified, the ceramic shell and preparation process are feedback controlled, and the control of recrystallization defects is realized.The application simulates the actual service environment of high-temperature alloy blade, and restores the performance of recrystallization defect sample in actual service environment.The application provides an experimental reproduction method and effective process control strategy for recrystallization defect research.

The present invention provides a positive electrode active material comprising at least one of a single particle consisting of one nodule and a quasi-single particle which is a composite of 30 or fewer nodules, wherein the degree of single crystallization defined by formula (A) is 2.7 or more. Formula (A): Degree of single crystallization = [Formula I] In formula (A), Ri is a radius of an i-th grain measured when a cross-section of an electrode is subjected to electron backscatter diffraction (EBSD) analysis after ion milling treatment of the electrode manufactured by applying the positive electrode active material, and is a value measured in units of ㎛, but the value substituted into formula (A) is a unitless number that does not include a unit, and n is a total number of grains measured through the electron backscatter diffraction (EBSD) analysis.

The invention discloses a method and system for determining anisotropic thermoelectric performance of a material based on tensor inversion, and the method comprises the steps: obtaining an Euler angle of a single crystal or texture polycrystalline sample in any orientation through electron back scattering diffraction, and building a rotation matrix between a sample coordinate system and a crystal coordinate system; measuring thermoelectric parameters such as resistivity, thermal conductivity and / or Seebeck coefficient under the sample coordinate system; and constructing a linear equation set based on a second-order tensor rotation formula, and inversely solving an intrinsic thermoelectric tensor component under a crystal coordinate system. According to the method, the intrinsic anisotropic thermoelectric performance of the material along the crystal main axis can be accurately obtained without strict crystal orientation cutting, and the method has the advantages of being high in universality, high in precision, easy and convenient to operate and the like and is suitable for high-throughput characterization of complex crystal system materials and device optimization design.

The invention discloses a hydrogen-induced cracking molecular dynamics-cohesion cross-scale simulation method which comprises the following steps: constructing a geometric model reflecting an actual material microstructure on the basis of multi-scale structure characteristics such as grain size, grain boundary angle and the like obtained by metallographic observation and electron back scattering diffraction test; simulating a fracture process of a microscopic interface under different hydrogen concentrations through a molecular dynamics method, obtaining traction-separation data, and calibrating core parameters of the cohesion model; embedding the parameters into a polycrystalline finite element model constructed based on a Thiessen polygon to realize parameter transmission and coupling calculation from a micro scale to a micro scale; the cohesion unit accurately describes hydrogen-induced grain boundary damage and crack propagation behaviors. According to the method, through multi-scale correlation modeling and direct parameter calibration, the reliability and prediction precision of the model are remarkably improved, and a theoretical basis and an engineering applicable tool are provided for hydrogen embrittlement resistance design and service life evaluation of a hydrogen equipment material.

The invention belongs to the technical field of metal material detection, and particularly relates to an iron-metal duplex stainless steel microstructure EBSD sample preparation method, which comprises: (1) sequentially carrying out coarse grinding treatment, fine grinding treatment and mechanical polishing treatment on an iron-metal duplex stainless steel sample; (2) by taking the stainless steel contact as a cathode and the iron horse duplex stainless steel sample as an anode, arranging the to-be-polished surface of the sample and the stainless steel contact in parallel and immersing the to-be-polished surface and the stainless steel contact into the electrolyte together, and switching on a power supply for electrolytic polishing; and (3) the sample obtained after electrolytic polishing is cleaned and blow-dried, and the iron-metal duplex stainless steel microstructure EBSD sample is obtained. The surface cleanliness of the iron-metal duplex stainless steel EBSD sample prepared by the method provided by the invention meets the requirements of electron back scattering diffraction on the sample, and more reliable conditions are provided for accurately measuring the microstructure of the iron-metal duplex stainless steel.

The application discloses a hydrogen-induced cracking molecular dynamics-cohesion cross-scale simulation method, comprising the following steps: constructing a geometric model reflecting the actual microstructure of a material based on the multi-scale structure characteristics such as grain size and grain boundary angle obtained through metallographic observation and electron backscatter diffraction experiments; simulating the fracture process of a micro-interface under different hydrogen concentrations through a molecular dynamics method, obtaining traction-separation data, and calibrating the core parameters of a cohesion model; embedding the above parameters into a polycrystalline finite element model constructed based on a tessellation polygon, realizing parameter transmission and coupled calculation from a micro-scale to a meso-scale; and accurately describing hydrogen-induced grain boundary damage and crack propagation behavior through a cohesion element. The method significantly improves the reliability and prediction accuracy of the model through multi-scale correlation modeling and direct parameter calibration, and provides a theoretical basis and an engineering applicable tool for hydrogen-induced cracking resistance design and life assessment of equipment materials.

The present invention refers to a proximity sensor for electron backscatter diffraction (EBSD) systems, particularly, a proximity sensor for collision avoidance between an EBSD sensor of an EBSD system and a stage of a scanning electron microscope (SEM) equipped with the EBSD system, and a corresponding method for proximity monitoring. The proximity sensor comprises emitter(s) to provide a light beam or light curtain which is basically directed parallel to an active area of the EBSD sensor and transmitted across the active area of the EBSD sensor at a distance selected as an alerting distance for the proximity sensor during collision monitoring; and receiver(s) located opposite to the emitter with respect to the active area of the EBSD sensor, configured to detect the light beam or light curtain and to provide a signal corresponding to the intensity of the light beam or light curtain for collision monitoring.

A positive electrode active material, a preparation method thereof, a positive electrode including the same, and a rechargeable lithium battery are disclosed. The positive electrode active material includes a positive electrode active material including a lithium nickel-based composite oxide and having a secondary particle form in which a plurality of primary particles are agglomerated, wherein an average size of the primary particles measured through electron backscatter diffraction (EBSD) analysis of a cross-section of the secondary particles is about 1.05 μm to about 1.5 μm, a standard deviation of the size of the primary particles is less than or equal to about 0.3 μm, and an average aspect ratio of the primary particles is less than or equal to about 1.7.

Flake-like copper particles according to the present invention have an average number of crystal grains of 150 to 2,000 inclusive as measured by observing cross-sectional surfaces of the flake-like copper particles by an electron backscattered diffraction method. When viewed in plan, if the longest line segment crossing a particle is defined as the major axis and the perpendicular bisector of the major axis is defined as the minor axis, the number of crystal grains in the plan view is 4.5 per µm2 to 40.0 per µm2 inclusive with respect to the value (µm2) of the product of the major axis length and the minor axis length. It is preferable that the crystal grain size is 0.2 µm to 1.3 µm inclusive. In a plan view, it is preferable that the average size of the crystal grains that are positioned in the peripheral region of a particle is smaller than the average size of the crystal grains that are positioned in the central region of the particle.

Provided are an austenitic alloy material, an exhaust part, and an exhaust gas purification device that exhibit excellent thermal fatigue properties even in a relatively low-temperature environment. [Solution] The chemical composition, in mass%, is C: 0.200% or less, Si: less than 4.00%, Mn: 2.00% or less, P: 0.050% or less, S: 0.0050% or less, Ni: 5.00 to 50.00%, Cr: 12.00 to 30.00%, Cu: more than 0% and 3.00% or less, Mo: more than 0% and 4.00% or less, V: more than 0% and 1.00% or less, Al: 1.000% or less, Ti: 1.500% or less, N: 0.400% or less, optionally added elements, balance: Fe and impurities, and the KAM measured using electron backscatter diffraction. M , G.O.S. M and HAGB M The value of [KAM M ×GOS M / HAGB M An austenitic alloy material that satisfies the following requirements.

Provided is a material for an electronic component which has high solder wettability even when heated at, e.g., 400°C while anticipating assembly of a semiconductor package, and with which it is possible to suppress deterioration of connection reliability resulting from Ni atoms constituting an Ni-containing layer diffusing to the surface and reacting with solder or a wire, even when the material for an electronic component is used in a high-temperature environment of around 120°C.　A material 1 for an electronic component includes a base body 2 composed of an electroconductive material, and a surface coating film 3 formed on at least part of a surface 21 of the base body 2. The surface coating film 3 has an Ni-containing layer 31 that contains Ni. The Ni-containing layer 31 has an average crystal grain size within the range of 0.10-0.50 μm when viewed in a cross-section including the thickness direction t. The average value of GAM in the cross-section, obtained from crystal orientation analysis performed using an electron backscatter diffraction (EBSD) method, is within the range of 0.95-2.00°, and the mode value of GAM in the cross-section is 0.7° or higher.

An oriented magnetic core lamination technique and a method of producing circular lamination cores. The method includes cutting rectangular strips with teeth pointing in a single direction (may not be the traverse or rolling direction) from the steel sheet plane, as opposed to directly punching circular laminates from the steel sheet with the teeth pointing in all directions. The strips are cut in such a way that the short side is aligned to the direction that has the best magnetic properties. The strips can then be bent into a donut or toroidal shape, either inwardly (with teeth pointing to the circle center) or outwardly (with teeth pointing out of the center) depending on the design of the lamination core. The direction with the best magnetic properties may be determined by non-destructive methods such as magnetic Barkhausen noise (MBN) analysis, x-ray diffraction (XRD), or electron backscatter diffraction (EBSD).

To provide a positive electrode active material capable of securing high capacity, long life, and high output, a method for manufacturing the same, a positive electrode including the same, and a lithium secondary battery.SOLUTION: A positive electrode active material according to an embodiment includes a lithium nickel-based composite oxide and is in the form of a secondary particle in which a plurality of primary particles are agglomerated, wherein an average particle size of the primary particles measured by electron backscatter diffraction (EBSD) analysis on a cross-section of the secondary particle is in a range of 1.05 μm to 1.5 μ m, a standard deviation of the particle size of the primary particles is 0.3 μm or less, and an aspect ratio of the primary particles is 1.7 or less.SELECTED DRAWING: Figure 1

The invention relates to thermal effect simulation in electrical discharge machining, in particular to a simulation method for a temperature field and a thermal stress field in electrical discharge machining. The method comprises the steps of collecting data through discharge machining experiment parameters, analyzing a single pulse discharge waveform, carrying out material microstructure characterization through a scanning electron microscope and an electron back scattering diffraction technology, establishing a physical model comprising an electrode, a workpiece and a plasma channel, carrying out model simplification, and setting a heat conduction model and a heat source model. Electric and magnetic field boundary conditions and heat conduction and fluid heat transfer conditions of a discharge channel are set, thermodynamic coupling analysis is carried out in ABAQUS software, the distribution condition of a transient heat effect and a stress field in discharge machining is simulated, numerical solution is carried out in combination with experimental data, and therefore the change condition of the temperature of the surface of a workpiece and the change condition of the thermal stress field in the machining process are obtained. Through the method, the distribution of thermal stress can be accurately predicted, and a theoretical basis is provided for optimizing a processing technology and reducing generation of microcracks.

Provided is a crystal evaluation method and a crystal evaluation device that can detect and evaluate efficiently in a short time multiple types of defects that may exist in SiC crystal, as well as a SiC substrate, a SiC device, and a SiC epitaxial wafer, each containing only a certain level or less of defects evaluated by the crystal evaluation method. A crystal evaluation method of evaluating a crystal state of a SiC crystal has at least a detection process of acquiring Kikuchi patterns at a plurality of measurement points of the SiC crystal using an electron backscatter diffraction method, and an evaluation process of evaluating the crystal state of the SiC crystal through image analysis of the Kikuchi pattern of each measurement point obtained in the detection process.

This invention discloses a method for quantitatively revealing the initiation amount of grain-scale deformation mechanisms, belonging to the field of microscopic plastic deformation and crystal plasticity finite element simulation technology. This method combines in-situ / quasi-in-situ electron backscattering diffraction characterization with crystal plasticity finite element simulation. It obtains accurate initial grain orientation distribution and grain morphology evolution information through experiments and incorporates it into the finite element model to achieve precise quantitative analysis of deformation mechanisms such as slip and twinning. Compared with traditional methods, this method overcomes the limitations of experiments in quantitatively characterizing the initiation amount of grain-scale deformation mechanisms, while also overcoming the problem of large errors in conventional simulation methods at the grain scale. Through the deep integration of experiments and simulations, this method significantly improves the accuracy of quantitative analysis of deformation mechanisms, providing strong technical support for the study of microscopic plastic deformation mechanisms.

The present invention relates to a positive electrode material, and to a positive electrode and a lithium secondary battery comprising same. The positive electrode material comprises a first positive electrode active material in the form of secondary particles having a primary particle size of 1.5 μm or greater and 5.0 μm or less, and a second positive electrode active material in the form of secondary particles having a primary particle size of less than 1.0 μm, wherein the first positive electrode active material has a larger average particle diameter (D50) according to a volume cumulative distribution measured using a laser diffraction particle size analyzer than the second positive electrode active material, and the number of grains per unit area, calculated by equation 1 of the present invention from an electron backscatter diffraction (EBSD) pattern of a cross-sectional SEM image of the positive electrode material, satisfies a specific range, thereby improving electrochemical properties, such as capacity characteristics and efficiency, of an electrode and a battery comprising positive electrode material.

The invention provides an FIB-TKD processing characterization method for the integral cross section of micron particles, which comprises the following steps: step 1, sample preparation: loading powder particles on the cross section of a sheared copper foil with the thickness of 10-dozens of microns, clamping the copper foil on a sample support with the edge exposed by 1-3mm, putting the copper foil into a double-beam electron microscope, depositing a protective layer on the upper surface of the powder particles, and carrying out sample preparation; and carrying out enhanced deposition on two sides of the powder particles. Step 2, thinning: thinning the particles by using a TEM (Transmission Electron Microscope) sample preparation program; and step 3, TKD characterization: enabling the thin area of the powder particles to form an angle of 20 degrees with the horizontal plane, inserting an electron backscatter diffraction (EBSD) detector, and carrying out TKD characterization. According to the method, by optimizing the process, FIB preparation and TKD characterization are integrated, fixation is enhanced, the conductivity of a deposition layer is enhanced, the deposition efficiency is improved, the whole particle cross section can be prepared, and characterization is successful.

The present invention provides: a copper-based wire material that, even when the size of a member such as a semiconductor device in which the copper-based wire material is used is reduced, is unlikely to cause damage to a bonding counterpart material such as a semiconductor chip during bonding to the bonding counterpart material, and that enables an improvement in bonding properties to bonding counterpart materials; and a semiconductor device that uses the same.　This copper-based wire material comprises not less than 99.96 mass% copper (Cu), wherein in a crystal orientation analysis via electron backscatter diffraction (EBSD) performed in a first measurement region which is in a cross-section perpendicular to the extension direction, the average KAM value of all measurement points included in the first measurement region is not more than 0.70°.

The invention discloses a crystal structure analysis device and method. The crystal structure analysis device comprises: an electron backscatter diffraction (EBSD) data acquisition module for acquiring EBSD data of a solid material; an image generation module for generating a shape of the solid material as a first image including a plurality of pixels; a clustering module for performing clustering on the plurality of pixels by using the EBSD data such that the first image includes a plurality of clusters, each cluster representing a crystal orientation; an image processing module for processing the first image such that the first image is displayed in a different color for each cluster to generate a second image; and a rendering module for rendering the second image to the display area.

One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a room-temperature GOS value in the range of 4° to 12°. The room-temperature GOS value is measured at room temperature for a cross-section of the copper foil using an electron backscatter diffraction (EBSD) pattern analyzer.

One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a room-temperature GOS value in the range of 4° to 12°. The room-temperature GOS value is measured at room temperature for a cross-section of the copper foil using an electron backscatter diffraction (EBSD) pattern analyzer.

The utility model provides a hot inlaying device. The hot inlaying device comprises a mold assembly and a demolding assembly, the die assembly comprises a male die and a female die provided with a stepped through hole, and the stepped through hole is composed of a die cavity part and a forming cavity part which are coaxially communicated. The inner wall of the die cavity part is in clearance fit with the male die; the radial size of the forming cavity part is larger than that of the die cavity part for accommodating inlay materials; the demolding assembly comprises a limiting cylinder and a demolding rod which are coaxially arranged in a sleeved mode. The limiting cylinder is provided with a matching cavity part in clearance fit with the outer wall of the female die; the lower portion of the limiting cylinder is provided with a demolding cavity with the radial size larger than that of the forming cavity. The male die is used for compacting the inlay material in the forming cavity part; the demolding rod is in clearance fit with the mold cavity part and used for pushing the male mold to guide the embedded sample into the demolding cavity part. The device can be used for inlaying samples with different sizes and shapes, especially inlaying small-size samples, and can meet the requirement that the small-size samples need to be placed in tests such as electron backscatter diffraction. The use amount of mounting powder can be effectively reduced, and the experiment cost is reduced.

The present disclosure relates to a positive electrode active material, a method of preparing the same, a positive electrode including the positive electrode active material, and a rechargeable lithium battery. The positive electrode active material includes: a positive electrode active material including a lithium nickel-based composite oxide and having a form of secondary particles in which a plurality of primary particles aggregate, in which an average size of the primary particles measured by electron backscatter diffraction (EBSD) analysis of a cross-section of the secondary particles is about 1.05 [mu] m to about 1.5 [mu] m, the standard deviation of the size of the primary particles is less than or equal to about 0.3 [mu] m, and the average aspect ratio of the primary particles is less than or equal to about 1.7.