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169 results about "Electron backscatter diffraction" patented technology

Electron backscatter diffraction (EBSD) is a scanning electron microscope–based microstructural-crystallographic characterization technique commonly used in the study of crystalline or polycrystalline materials. The technique can provide information about the structure, crystal orientation, phase, or strain in the material. Traditionally these types of studies have been carried out using X-ray diffraction (XRD), neutron diffraction and/or electron diffraction in a Transmission electron microscope.

Modeling method and system of crystal plasticity finite element model for weld microstructure crystal plasticity

The invention relates to the technical field of metal material processing engineering, discloses a full-automatic full-process modeling method and system of crystal plasticity finite element model for laser welding weld, which adopts MATLAB to call ABAQUS and PYTHON for co-simulation programming. In this text, a full-automatic modeling method of the crystal plasticity finite element model for laser welding weld is proposed, and a one-key crystal plastic finite element model for laser welding weld is established based on EBSD experimental data. In addition, the full-process full-automatic modeling method of crystal plastic finite element for laser welding weld is universal, and can be used for the establishment of the crystal plasticity finite element model for the microstructure of the base material of aluminum alloy, titanium alloy, magnesium alloy, stainless steel and other materials.
Owner:HUAZHONG UNIV OF SCI & TECH

Composite material performance prediction method based on multi-field coupling multi-scale analysis and knowledge graph

The invention discloses a composite material performance prediction method based on multi-field coupling multi-scale analysis and a knowledge graph, which integrates microstructure modeling, graph neural network representation learning, cross-scale parameter coupling modeling and robust optimization analysis. The method is suitable for prediction and design of key mechanical properties such as modulus, strength and toughness of a thermosetting / thermoplastic composite material under different working conditions. The method comprises the following steps: firstly, constructing a grain-level tissue knowledge graph based on an electron backscatter diffraction image, secondly, constructing a multi-scale input system comprising a microscopic variable (such as a fiber volume fraction), a mesoscopic variable (such as a layer thickness sequence) and a macroscopic variable (such as a load condition), and finally, performing robust optimization by utilizing a multi-objective evolutionary algorithm to obtain a multi-scale input system. And outputting a material performance prediction result and a knowledge graph associated with the ji structure-process-performance. According to the method, the accuracy and interpretability of performance prediction of the composite material can be remarkably improved, and data-knowledge dual-drive support is provided for design optimization of the high-performance composite material.
Owner:SHANGHAI UNIV

Crystal plasticity and cohesion model coupling hydrogen induced cracking simulation method based on test

The invention discloses a test-based crystal plasticity and cohesion model coupling hydrogen induced cracking simulation method, which comprises the following steps: carrying out a hydrogen filling mechanical property test on a metal material to obtain a true stress-true strain curve of the metal material in a hydrogen environment; carrying out a hydrogen-filled fracture toughness test on the metal material to obtain a stress intensity factor of the metal material in a hydrogen environment; constructing a cohesion constitutive model; a metal material electron back scattering diffraction microscopic characterization test is carried out, microstructure characteristics are obtained, and a polycrystalline model is constructed; constructing a crystal plastic constitutive model; coupling crystal plasticity constitutive and cohesion constitutive, and calibrating crystal plasticity to-be-determined parameters by adopting a trial-and-error method; and carrying out finite element simulation analysis on hydrogen-induced cracking behaviors with different microstructure characteristics in a hydrogen environment to obtain stress-strain data and crack data of the hydrogen-induced cracking behaviors. According to the invention, high-precision simulation of the hydrogen-induced cracking micromechanism of the metal material in the hydrogen environment is realized.
Owner:SOUTHWEST PETROLEUM UNIV

Multi-scale simulation method for thermal compression deformation behavior of TC4 titanium alloy

The invention discloses a multi-scale simulation method for a thermal compression deformation behavior of TC4 titanium alloy, and belongs to the field of metal material processing simulation. Comprising the following steps: 1, carrying out thermal compression experiments at different temperatures to obtain a deformed sample; 2, analyzing the grain orientation, orientation difference angle and texture evolution of the sample by using an electron back scattering diffraction technology; 3, constructing a crystal plasticity finite element model, and simulating a polycrystalline deformation process; 4, constructing a molecular dynamics model, and simulating phase change and dislocation evolution in thermal compression and cooling processes; and 5, based on a multi-scale simulation result, hot working parameters are optimized, dynamic recrystallization and a beta-to-alpha phase change path are regulated and controlled, and grain refinement and performance homogenization are achieved. The invention discloses a correlation mechanism of the microstructure and the mechanical property in TC4 titanium alloy thermal compression deformation, and provides a theoretical basis for optimization of a thermal processing technology of a high-performance titanium alloy component in the aerospace field.
Owner:TIANJIN UNIVERSITY OF TECHNOLOGY

Titanium alloy microscopic structure detection method and device

The invention belongs to the crossing field of material science and image recognition, and particularly discloses a titanium alloy microscopic structure detection method and device, and the method comprises the steps: obtaining an electron back scattering diffraction (EBSD) image sample of a titanium alloy; obtaining block-shaped alpha-phase mask information corresponding to the EBSD image sample by analyzing grain characteristics in the EBSD image sample; the first round of training is that an initial deep learning model is trained based on the EBSD image sample and the corresponding block alpha phase mask information, and the deep learning model is used for identifying the block alpha phase of the titanium alloy in the image based on the input image; a second round of training: carrying out data enhancement operation on the EBSD image sample to obtain an enhanced sample, and carrying out continuous training on the model obtained by the first round of training based on the enhanced sample; and a third round of training: based on a metallographic image sample, carrying out migration training on the model obtained by the second round of training. By means of the method and device, efficient and accurate titanium alloy microscopic structure detection can be achieved.
Owner:BEIJING RESEARCH INSTITUTE OF MECHANICAL & ELECTRICAL TECHNOLOGY CO LTD CAM

Crystal orientation detection system and detection method thereof

The invention relates to a crystal orientation detection system, which comprises an LED surface type array, an illumination lens, a reflector, a microscope objective, a sample stage, a tube lens, an image sensor and a computer, and is characterized in that the LED surface type array comprises m * n LED light sources which are uniformly distributed along the radial direction and the annular direction and are independently controlled by the computer; the illumination lens, the reflector and the microscope objective form an illumination light path, the microscope objective and the tube lens form a microscopic imaging light path, the reflector refracts an illumination light beam to the microscope objective at an inclination angle of 45 degrees, and the computer synchronously controls gating of the LED face type array and image acquisition of the image sensor. According to the technical scheme, the LED light source is long in service life and low in energy consumption, a complex vacuum environment and high-voltage equipment are not needed, optical assemblies such as a reflecting mirror, a microobjective and a tube mirror are mature and easy to obtain, and the overall manufacturing cost of the system is only 10%-20% of that of an electron backscatter diffractometer (EBSD) which is the most commonly used crystal orientation detection device at present.
Owner:SHANGHAI JIAOTONG UNIV

Sintered aluminum-nickel-cobalt magnetic steel and preparation method thereof

The invention relates to sintered aluminum-nickel-cobalt magnetic steel and a preparation method thereof. In an electron backscatter diffraction pole diagram of the sintered aluminum-nickel-cobalt magnetic steel, along lt; 100 gt; the direction orientation degree is greater than or equal to 2.5, and the density of the sintered aluminum-nickel-cobalt magnetic steel is greater than or equal to 7.00 g / cm < 3 >. According to the sintered aluminum-nickel-cobalt magnetic steel, the orientation degree is improved, meanwhile, the high densification degree is achieved, and therefore the hard magnetic performance of the sintered aluminum-nickel-cobalt magnetic steel is remarkably improved.
Owner:HANGZHOU PERMANENT MAGNET GRP +1

Aluminum conductor electrical melting mark identification method based on electron backscatter diffraction (EBSD)

The invention relates to the technical field of material microscopic analysis, and particularly discloses an aluminum conductor electrical melting mark identification method based on electron back scattering diffraction. Aiming at the core defects that the existing aluminum melting mark identification technology depends on morphological characteristic analysis and cannot distinguish short-circuit melting and fire thermal damage, the invention innovatively proposes the following steps: (1) obtaining a three-dimensional crystallographic parameter group of a grain size distribution discrete coefficient (DSC), a high-angle grain boundary (HAGBgt; 15 degrees) proportion and a cubic texture strength proportion of a melting mark area through EBSD scanning; (2) a melting mark classification model based on a random forest algorithm is constructed, quantitative distinguishing of electrical short circuit melting marks (DSCgt, 0.8, Cube% lt, 15%) and fire disaster hot melting marks (DSClt, 0.5, Cube% gt, 40%) is achieved, and the classification accuracy rate reaches 98.2%. And surface amorphous layer interference is further eliminated through argon ion polishing pretreatment (with an inclination angle of 3-5 degrees for 18 min), so that the signal-to-noise ratio of the EBSD Kikuchi pattern quality map is increased by 3 times. According to the invention, the technical problem of poor objectivity of melting mark type judgment is solved, and a high-precision analysis tool is provided for electrical fire evidence identification.
Owner:SHANGHAI FIRE RES INST OF MEM

Twin crystal nucleation position and variant selection prediction method based on machine learning

The invention discloses a twin crystal nucleation position and variant selection prediction method based on machine learning, and belongs to the crossing field of material science and machine learning. The method comprises the following steps: acquiring microscopic structure data of a deformation material through electron back scattering diffraction, and constructing a multi-dimensional data set containing crystal grain parameters, crystal boundary parameters and deformation mechanism parameters by taking crystal grains and a certain crystal boundary combination as an analysis unit; and then modeling and predicting the twin crystal nucleation position and variant selection respectively by adopting a hierarchical machine learning modeling strategy. According to the method, the twinning behavior in the polycrystalline material can be efficiently and accurately predicted, and theoretical support and a technical path are provided for high-performance metal material design and plastic deformation mechanism research.
Owner:CHONGQING UNIV

Residual creep life prediction method based on microscopic damage characteristics

The invention discloses a residual creep life prediction method based on microscopic damage characteristics. The residual creep life prediction method comprises the following steps: acquiring interrupt samples in different damage states through a creep interrupt test; quantitatively characterizing the grain boundary orientation difference and the geometric necessary dislocation density of the interrupted sample by using an electron back scattering diffraction technology; a quantitative damage index is constructed based on the grain boundary orientation difference and the geometric necessary dislocation density, the quantitative damage index is used as an internal variable to be coupled into a Marson-Miller parameter model, and a microscopic-macroscopic associated residual life prediction model is established; and through a microscopic-macroscopic associated residual life prediction model, predicting the residual life of the material under different service times to obtain the residual creep life. According to the method, the microscopic damage state in the material can be directly and quantitatively reflected, early, sensitive and accurate prediction of the residual creep life of the in-service component is realized, and a reliable basis is provided for safe operation and maintenance decision of an overdue service unit of a power plant.
Owner:SPECIAL EQUIP SAFETY SUPERVISION INSPECTION INST OF JIANGSU PROVINCE

Copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same

PendingCN122314906AMetallurgyElectrical battery
One embodiment of this disclosure provides a copper foil comprising a copper film having a matte surface and a glossy surface; and a protective layer disposed on the copper film; wherein, when a boundary with an orientation difference of 5° or greater between adjacent pixels is considered a grain boundary, the area ratio of grains (including twins) with a room temperature GOS value of 0° to less than 2° is 45% to 95% of the total cross-sectional area. The room temperature GOS value is measured on the cross-section of the copper foil at room temperature using an electron backscatter diffraction (EBSD) pattern analyzer.
Owner:SK NEXILIS CO LTD

A method for simulating and controlling recrystallization defects of a second generation nickel-based single crystal superalloy and a second generation nickel-based single crystal superalloy

The application discloses a kind of second generation nickel-based single crystal superalloy recrystallization defect simulation and control method.The method steps are: according to sample preparation wax mold, after sand blasting, dry baking, manufacture ceramic shell;Through directional solidification preparation second generation nickel-based single crystal superalloy sample, control pulling speed, holding temperature and temperature gradient and other parameters;According to service condition preparation sample, simulate stress loading, in combination with heat treatment simulate actual service environment;Using electron backscattering diffraction and X-CT imaging, characterize recrystallization grain orientation distribution, three-dimensional morphology, content and thickness.Process parameter-defect characteristic mapping relationship is established, the stress distribution characteristics during preparation are clarified, the ceramic shell and preparation process are feedback controlled, and the control of recrystallization defects is realized.The application simulates the actual service environment of high-temperature alloy blade, and restores the performance of recrystallization defect sample in actual service environment.The application provides an experimental reproduction method and effective process control strategy for recrystallization defect research.
Owner:SHANGHAI UNIV +1

Positive electrode active material precursor, manufacturing method thereof, positive electrode active material, positive electrode, and electrochemical device

The present invention provides a positive electrode active material comprising at least one of a single particle consisting of one nodule and a quasi-single particle which is a composite of 30 or fewer nodules, wherein the degree of single crystallization defined by formula (A) is 2.7 or more. Formula (A): Degree of single crystallization = [Formula I] In formula (A), Ri is a radius of an i-th grain measured when a cross-section of an electrode is subjected to electron backscatter diffraction (EBSD) analysis after ion milling treatment of the electrode manufactured by applying the positive electrode active material, and is a value measured in units of ㎛, but the value substituted into formula (A) is a unitless number that does not include a unit, and n is a total number of grains measured through the electron backscatter diffraction (EBSD) analysis.
Owner:LG ENERGY SOLUTION LTD

Method and system for determining anisotropic thermoelectric performance of material based on tensor inversion

The invention discloses a method and system for determining anisotropic thermoelectric performance of a material based on tensor inversion, and the method comprises the steps: obtaining an Euler angle of a single crystal or texture polycrystalline sample in any orientation through electron back scattering diffraction, and building a rotation matrix between a sample coordinate system and a crystal coordinate system; measuring thermoelectric parameters such as resistivity, thermal conductivity and / or Seebeck coefficient under the sample coordinate system; and constructing a linear equation set based on a second-order tensor rotation formula, and inversely solving an intrinsic thermoelectric tensor component under a crystal coordinate system. According to the method, the intrinsic anisotropic thermoelectric performance of the material along the crystal main axis can be accurately obtained without strict crystal orientation cutting, and the method has the advantages of being high in universality, high in precision, easy and convenient to operate and the like and is suitable for high-throughput characterization of complex crystal system materials and device optimization design.
Owner:INSTITUTE OF PHYSICS CHINESE ACADEMY OF SCIENCES

Molecular dynamics-cohesion cross-scale simulation method for hydrogen induced cracking

The invention discloses a hydrogen-induced cracking molecular dynamics-cohesion cross-scale simulation method which comprises the following steps: constructing a geometric model reflecting an actual material microstructure on the basis of multi-scale structure characteristics such as grain size, grain boundary angle and the like obtained by metallographic observation and electron back scattering diffraction test; simulating a fracture process of a microscopic interface under different hydrogen concentrations through a molecular dynamics method, obtaining traction-separation data, and calibrating core parameters of the cohesion model; embedding the parameters into a polycrystalline finite element model constructed based on a Thiessen polygon to realize parameter transmission and coupling calculation from a micro scale to a micro scale; the cohesion unit accurately describes hydrogen-induced grain boundary damage and crack propagation behaviors. According to the method, through multi-scale correlation modeling and direct parameter calibration, the reliability and prediction precision of the model are remarkably improved, and a theoretical basis and an engineering applicable tool are provided for hydrogen embrittlement resistance design and service life evaluation of a hydrogen equipment material.
Owner:SOUTHWEST PETROLEUM UNIV

Iron-metal duplex stainless steel microstructure EBSD sample and sample preparation method

The invention belongs to the technical field of metal material detection, and particularly relates to an iron-metal duplex stainless steel microstructure EBSD sample preparation method, which comprises: (1) sequentially carrying out coarse grinding treatment, fine grinding treatment and mechanical polishing treatment on an iron-metal duplex stainless steel sample; (2) by taking the stainless steel contact as a cathode and the iron horse duplex stainless steel sample as an anode, arranging the to-be-polished surface of the sample and the stainless steel contact in parallel and immersing the to-be-polished surface and the stainless steel contact into the electrolyte together, and switching on a power supply for electrolytic polishing; and (3) the sample obtained after electrolytic polishing is cleaned and blow-dried, and the iron-metal duplex stainless steel microstructure EBSD sample is obtained. The surface cleanliness of the iron-metal duplex stainless steel EBSD sample prepared by the method provided by the invention meets the requirements of electron back scattering diffraction on the sample, and more reliable conditions are provided for accurately measuring the microstructure of the iron-metal duplex stainless steel.
Owner:SHANXI TAIGANG STAINLESS STEEL CO LTD

Printed wiring board

This printed wiring board includes a base film and a lamination part. The base film has a main surface. The lamination part is disposed on the main surface. A first area ratio is defined in the following way: the cross section of the lamination part is measured by an electron beam backward scattering diffraction method under a condition that a grain boundary threshold is 10° or less, and the ratio of the area occupied by crystal grains having an equivalent circle diameter of 3 μm or more in a first region is the first area ratio, the first area being an area up to 4 μm from the main surface. The first area ratio is 0.8 or more.
Owner:SUMITOMO ELECTRIC INDUSTRIES LTD +1

A hydrogen induced cracking molecular dynamics-cohesion multiscale simulation method

The application discloses a hydrogen-induced cracking molecular dynamics-cohesion cross-scale simulation method, comprising the following steps: constructing a geometric model reflecting the actual microstructure of a material based on the multi-scale structure characteristics such as grain size and grain boundary angle obtained through metallographic observation and electron backscatter diffraction experiments; simulating the fracture process of a micro-interface under different hydrogen concentrations through a molecular dynamics method, obtaining traction-separation data, and calibrating the core parameters of a cohesion model; embedding the above parameters into a polycrystalline finite element model constructed based on a tessellation polygon, realizing parameter transmission and coupled calculation from a micro-scale to a meso-scale; and accurately describing hydrogen-induced grain boundary damage and crack propagation behavior through a cohesion element. The method significantly improves the reliability and prediction accuracy of the model through multi-scale correlation modeling and direct parameter calibration, and provides a theoretical basis and an engineering applicable tool for hydrogen-induced cracking resistance design and life assessment of equipment materials.
Owner:SOUTHWEST PETROLEUM UNIV

Systems and methods for performing sample extraction of highly reactive materials

Disclosed herein are methods and systems for performing sample extraction and protective cap placement for highly reactive materials within a charged particle microscope system. The methods include preparing a nested void in a support structure; transferring at least a portion of a sample into the nested void; and milling material from a region of the support structure that defines the nested void. Milling the material from the region of the support structure causes at least some of the removed material to redeposit to form an adhesive bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial section tomography of the sample, enhanced insertable backscatter detector (CBS) analysis of the sample, and electron backscatter diffraction (EBSD) analysis of the sample.
Owner:FEI CO

Proximity sensor for electron backscatter diffraction systems

The present invention refers to a proximity sensor for electron backscatter diffraction (EBSD) systems, particularly, a proximity sensor for collision avoidance between an EBSD sensor of an EBSD system and a stage of a scanning electron microscope (SEM) equipped with the EBSD system, and a corresponding method for proximity monitoring. The proximity sensor comprises emitter(s) to provide a light beam or light curtain which is basically directed parallel to an active area of the EBSD sensor and transmitted across the active area of the EBSD sensor at a distance selected as an alerting distance for the proximity sensor during collision monitoring; and receiver(s) located opposite to the emitter with respect to the active area of the EBSD sensor, configured to detect the light beam or light curtain and to provide a signal corresponding to the intensity of the light beam or light curtain for collision monitoring.
Owner:BRUKER NANO INC

A method for analyzing bainitic lath collision behavior using high-temperature in-situ observation combined with EBSD

This invention discloses a method for analyzing the collision behavior of bainitic laths using high-temperature in-situ observation combined with EBSD, relating to the field of high-strength steel phase transformation characterization technology. The method involves cutting the target steel into cylindrical samples; immersing the polished sample in an electrolyte for electrolytic polishing to remove the stress layer on the sample surface; placing the field of view of a high-temperature in-situ confocal laser microscope close to a specific region of a marked point and heating it; then performing electron backscatter diffraction observation on a specific region within the marked point of the sample after high-temperature in-situ confocal testing, observing the lath collision phenomenon; analyzing the bainitic lath collision behavior based on the electron backscatter data of the selected region combined with in-situ confocal morphology analysis; and employing phase-field simulation to simulate the growth and collision process of bainitic laths. This invention, by combining phase-field simulation and multiple microscopic characterization techniques, conducts a comprehensive study from microscopic to macroscopic levels, fully revealing the growth mechanism and collision behavior of bainitic laths.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Positive electrode active material, preparation method thereof, positive electrode, and rechargeable lithium batteries

A positive electrode active material, a preparation method thereof, a positive electrode including the same, and a rechargeable lithium battery are disclosed. The positive electrode active material includes a positive electrode active material including a lithium nickel-based composite oxide and having a secondary particle form in which a plurality of primary particles are agglomerated, wherein an average size of the primary particles measured through electron backscatter diffraction (EBSD) analysis of a cross-section of the secondary particles is about 1.05 μm to about 1.5 μm, a standard deviation of the size of the primary particles is less than or equal to about 0.3 μm, and an average aspect ratio of the primary particles is less than or equal to about 1.7.
Owner:SAMSUNG SDI CO LTD

Flake-like copper particles and conductive resin composition containing same

Flake-like copper particles according to the present invention have an average number of crystal grains of 150 to 2,000 inclusive as measured by observing cross-sectional surfaces of the flake-like copper particles by an electron backscattered diffraction method. When viewed in plan, if the longest line segment crossing a particle is defined as the major axis and the perpendicular bisector of the major axis is defined as the minor axis, the number of crystal grains in the plan view is 4.5 per µm2 to 40.0 per µm2 inclusive with respect to the value (µm2) of the product of the major axis length and the minor axis length. It is preferable that the crystal grain size is 0.2 µm to 1.3 µm inclusive. In a plan view, it is preferable that the average size of the crystal grains that are positioned in the peripheral region of a particle is smaller than the average size of the crystal grains that are positioned in the central region of the particle.
Owner:MITSUI MINING & SMELTING CO LTD

Calibration method of electron back scattering diffraction pattern and medium

The invention provides an electron back scattering diffraction pattern calibration method and a medium. The method comprises the following steps: creating a series of Kikuchi strip normal triangles and a series of reflecting surface normal triangles; a target reflecting surface normal triangle matched with the Kikuchi belt normal triangle is screened out; performing matching counting according to the normal triangle of the target reflecting surface and the normal triangle of the Kikuchi zone, endowing information of a target crystal plane family determined according to a matching counting result to the corresponding Kikuchi zone so as to determine the crystal plane family to which the Kikuchi zone belongs, and obtaining a target Kikuchi zone; calculating to obtain an orientation estimation value corresponding to each Kikuchi band combination; screening out an optimal Kikuchi zone combination from all Kikuchi zone combinations according to all orientation estimation values, and calculating a target orientation value according to the optimal Kikuchi zone combination; and calculating calibration precision according to the target orientation value, and if the calibration precision is lower than a preset precision threshold, determining that the electron back scattering diffraction pattern is successfully calibrated. According to the invention, the calibration precision can be improved.
Owner:SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI

Austenitic alloy material, exhaust parts and exhaust gas purification device

Provided are an austenitic alloy material, an exhaust part, and an exhaust gas purification device that exhibit excellent thermal fatigue properties even in a relatively low-temperature environment. [Solution] The chemical composition, in mass%, is C: 0.200% or less, Si: less than 4.00%, Mn: 2.00% or less, P: 0.050% or less, S: 0.0050% or less, Ni: 5.00 to 50.00%, Cr: 12.00 to 30.00%, Cu: more than 0% and 3.00% or less, Mo: more than 0% and 4.00% or less, V: more than 0% and 1.00% or less, Al: 1.000% or less, Ti: 1.500% or less, N: 0.400% or less, optionally added elements, balance: Fe and impurities, and the KAM measured using electron backscatter diffraction. M , G.O.S. M and HAGB M The value of [KAM M ×GOS M / HAGB M An austenitic alloy material that satisfies the following requirements.
Owner:NIPPON STEEL CORPORATION

Material for electronic component and method for producing same, lead frame material and method for producing same, and semiconductor package

Provided is a material for an electronic component which has high solder wettability even when heated at, e.g., 400°C while anticipating assembly of a semiconductor package, and with which it is possible to suppress deterioration of connection reliability resulting from Ni atoms constituting an Ni-containing layer diffusing to the surface and reacting with solder or a wire, even when the material for an electronic component is used in a high-temperature environment of around 120°C. A material 1 for an electronic component includes a base body 2 composed of an electroconductive material, and a surface coating film 3 formed on at least part of a surface 21 of the base body 2. The surface coating film 3 has an Ni-containing layer 31 that contains Ni. The Ni-containing layer 31 has an average crystal grain size within the range of 0.10-0.50 μm when viewed in a cross-section including the thickness direction t. The average value of GAM in the cross-section, obtained from crystal orientation analysis performed using an electron backscatter diffraction (EBSD) method, is within the range of 0.95-2.00°, and the mode value of GAM in the cross-section is 0.7° or higher.
Owner:FURUKAWA ELECTRIC CO LTD +1

Method for producing laminates suitable for magnetic cores

An oriented magnetic core lamination technique and a method of producing circular lamination cores. The method includes cutting rectangular strips with teeth pointing in a single direction (may not be the traverse or rolling direction) from the steel sheet plane, as opposed to directly punching circular laminates from the steel sheet with the teeth pointing in all directions. The strips are cut in such a way that the short side is aligned to the direction that has the best magnetic properties. The strips can then be bent into a donut or toroidal shape, either inwardly (with teeth pointing to the circle center) or outwardly (with teeth pointing out of the center) depending on the design of the lamination core. The direction with the best magnetic properties may be determined by non-destructive methods such as magnetic Barkhausen noise (MBN) analysis, x-ray diffraction (XRD), or electron backscatter diffraction (EBSD).
Owner:HIS MAJESTY THE KING IN RIGHT OF CANADA AS REPRESENTED BY THE MINISTER OF NATURAL RESOURCES

Thin film transistor and electronic device

A thin film transistor includes a metal oxide layer, an oxide semiconductor layer provided in contact with the metal oxide layer and containing a plurality of crystal grains, a gate electrode provided over the oxide semiconductor layer, and a gate insulating layer provided between the oxide semiconductor layer and the gate electrode. The oxide semiconductor layer includes a grain boundary having a crystal orientation difference greater than 5 degrees between two adjacent measurement points obtained by an electron backscatter diffraction (EBSD) method. An average KAM value calculated by the EBSD method is greater than or equal to 1.4 degrees.
Owner:JAPAN DISPLAY INC +1

Method for quantitatively revealing starting amount of grain size deformation mechanism

The invention discloses a method for quantitatively revealing the starting amount of a grain size deformation mechanism, and belongs to the technical field of finite element simulation of microcosmic plastic deformation and crystal plasticity. According to the method, in-situ / quasi-in-situ electron back scattering diffraction characterization and crystal plasticity finite element simulation are combined, real grain initial orientation distribution and grain shape evolution information are obtained through experiments and introduced into a finite element model, and accurate quantitative analysis of deformation mechanisms such as slippage and twinning is achieved. Compared with a traditional method, the method breaks through the limitation of an experiment in the aspect of quantitative characterization of the starting amount of a grain size deformation mechanism, and meanwhile the problem that a conventional simulation method is large in error under the grain size is solved. Through deep fusion of experiments and simulation, the quantitative analysis precision of the deformation mechanism is remarkably improved, and a powerful technical support is provided for research of the microcosmic plastic deformation mechanism.
Owner:CHONGQING UNIV

Surface coated cutting tool

In one aspect, cutting tools are described herein that include a wear resistant coating employing one or more polycrystalline alpha-Al2O3 refractory layers. In short, a coated cutting tool described herein includes a substrate, and a coating adhered to the substrate, the coating including a polycrystalline alpha-Al2O3 layer deposited by chemical vapor deposition (CVD), the polycrystalline alpha-Al2O3 layer having a length of sigma3 type grain boundaries as measured using electron backscatter diffraction (EBSD), the length is greater than 0% but less than 10% of the total length of all grain boundaries and has a texture coefficient (TC) greater than 6 for the (006) growth direction and a texture coefficient (TC) greater than 5 for the (012) growth direction.
Owner:KENNAMETAL INC