Copper alloy sheet material and method of producing the same

a technology of copper alloy sheet and alloy sheet, which is applied in the direction of conductive materials, metal/alloy conductors, and conductors, etc., can solve the problems of copper alloy sheet materials having problems, temperature elevation in the use environment, and thinness reduction of substrate materials in progress, and achieve excellent mechanical strength excellent bending properties

Inactive Publication Date: 2012-10-25
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0034]The copper alloy sheet material of the present invention is excellent in the bending property, has an excellent mechanical strength, and is suitable for lead frames, connectors, terminal materials, and the like, for electrical/electronic equipments, and for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like.
[0035]Further, the method of the present invention of produ...

Problems solved by technology

Secondly, under the circumstances of reduction of mineral resources or weight reduction of parts, thickness reduction of substrate materials is in progress.
Thirdly, temperature elevation in the use environment is in progress.
Further, along with the changes described above, copper alloy sheet materials have problems such as described below.
Firstly, along with the size reduction of terminals, the bending radius in bending that is applied to the contact portion or spring portion is decreased, and the material is subjected to bending that is more severe than conv...

Method used

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  • Copper alloy sheet material and method of producing the same
  • Copper alloy sheet material and method of producing the same
  • Copper alloy sheet material and method of producing the same

Examples

Experimental program
Comparison scheme
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example 1

[0077]As shown with the respective composition in the column of alloying elements in Table 1-1, an alloy containing at least one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being Cu and unavoidable impurities, was melted in a high-frequency melting furnace, followed by casting, to obtain an ingot. The resultant ingots in this state were used as test materials, and test specimens of copper alloy sheet materials of Examples 1-1 to 1-19 according to the present invention and Comparative Examples 1-1 to 1-9 were produced in any of the following A to F.

(Step A)

[0078]Each of the test specimens was produced in the following manner. The respective test material was subjected to a homogenization heat treatment at 1,020 to 700° C. for 10 minutes to 10 hours; three passes of hot-rolling at a working ratio of 25% or higher at a temperature in the range of 1,020° C. to (P+30)° C.; air cooling; three passes of hot-rol...

example 2

[0096]With respect to the copper alloys having the compositions shown in the column of alloying elements in Table 2, with the balance of Cu and unavoidable impurities, test specimens of copper alloy sheet materials of Examples 2-1 to 2-17 according to the present invention and Comparative Example 2-1 to 2-3 were produced in the same manner as in Example 1, and the test specimens were subjected to examination of the properties in the same manner as in Example 1.

[0097]The results are shown in Table 2.

TABLE 2Alloying elementsBendingIDNiCoSiOther elementspropertyYSECSRnumbermass %mass %mass %mass %StepRGWBWMPa% IACS%Ex 2-10.501.000.360.15Sn, 0.2AgD1.6◯◯67553.423.3Ex 2-21.000.500.380.03Zr, 0.05MnA2.1◯◯73750.220.7Ex 2-3—0.800.450.32Ti, 0.21FeC1.7◯◯71251.721.8Ex 2-40.501.500.350.2Ag, 0.05B, 0.1MgB1.4◯◯74051.223.4Ex 2-50.801.200.420.14Mg, 0.15Sn, 0.3ZnC1.8◯◯73549.919.6Ex 2-61.001.000.480.23Cr, 0.14Mg, 0.10PD1.6◯◯76048.521.8Ex 2-72.32—0.650.2Hf, 0.2ZnB1.9◯◯78539.824.4Ex 2-80.901.700.610.04Zr...

example 3

[0100]By using the copper alloy having the composition shown in Table 3, with the balance being Cu and inevitable impurities, the ingot was subjected to a homogenization heat treatment at 1,020 to 700° C. for 10 minutes to 10 hours, followed by hot-rolling as shown in Table 4, water cooling, face milling, cold-rolling at a working ratio of 50% to 99%, a heat treatment of maintaining at 600 to 900° C. for 10 seconds to 5 minutes, cold-working at a working ratio of 5% to 55%, and a final solution heat treatment of maintaining at 750 to 1,000° C. for 5 seconds to 1 hour. Then, the resultant sheet was subjected to an aging precipitation heat treatment at 350 to 600° C. for 5 minutes to 20 hours, finish rolling at a working ratio of 2 to 45%, and temper annealing of maintaining at 300 to 700° C. for 10 seconds to 2 hours, to produce a test specimen. The properties were examined in the same manner as in Example 1. The results are shown in Table 4.

TABLE 3Additive elementsNiCoSiSnZnMgCrmass...

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Abstract

A copper alloy sheet material, having an R value of 1 or greater, which is defined by:
R=([BR]+[RDW]+[W])/([C]+[S]+[B])
wherein [BR], [RDW], [W], [C], [S], and [B] represent an area ratio of crystal texture orientation component of BR orientation {3 6 2}<8 5 3>, RD-rotated-cube orientation {0 1 2}<1 0 0>, cube orientation {1 0 0}<0 0 1>, copper orientation {1 2 1}<1 1 1>, S-orientation {2 3 1}<3 4 6>, and brass orientation {1 1 0}<1 1 2>, respectively, in crystal orientation analysis in an EBSD (electron back scatter diffraction) analysis, and having a proof stress of 500 MPa or greater, and an electrical conductivity of 30%IACS or higher; and a production method of the same.

Description

TECHNICAL FIELD[0001]The present invention relates to a copper alloy sheet material and a method of producing the same, and specially the present invention relates to a copper alloy sheet material that can be applied to lead frames, connectors, terminal materials, relays, switches, sockets, and the like, for parts to be mounted on automotives or for electrical / electronic equipments, and to a method of producing the same.BACKGROUND ART[0002]Characteristics required for copper alloy sheet materials that are used in applications, such as lead frames, connectors, terminal materials, relays, switches, and sockets, for parts to be mounted on automotives or for electrical / electronic equipments, include, for example, electrical conductivity, proof stress (yield stress), tensile strength, bending property, and stress relaxation resistance. In recent years, the demanded levels for those characteristics become higher, concomitantly with the size reduction, weight reduction, enhancement of the ...

Claims

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Application Information

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IPC IPC(8): C22F1/08C22C9/10C22C9/00C22C9/04C22C9/05C22C9/06C22C9/02
CPCC22C9/06H01B1/026C22F1/08C22C9/00H01B1/02
Inventor KANEKO, HIROSHISATOEGUCHI, TATSUHIKO
Owner FURUKAWA ELECTRIC CO LTD
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