Wafer washing device

Abstract

The invention discloses a wafer washing device which comprises a shell, a supporting assembly, washing brushes and a protecting plate. The supporting assembly is located in the shell and used for supporting a wafer to be washed in a rotating manner, wherein the wafer is arranged in the vertical direction. The washing brushes are arranged in parallel and at intervals and roll around the axes of thewashing brushes. The protecting plate is arranged on the upper sides of the washing brushes, so that fluid generated by rolling of the washing brushes is stopped from splashing down to the surface ofthe wafer.

Description

technical field [0001] The invention belongs to the technical field of wafer cleaning, in particular to a wafer cleaning device. Background technique [0002] Cleaning is one of the most important and frequent steps in the semiconductor manufacturing process. Generally speaking, in the wafer manufacturing process, up to 20% of the steps are cleaning steps. The purpose of cleaning is to avoid contamination of semiconductor devices by trace ions and metal particles, and to ensure the performance and pass rate of semiconductor devices. Wafer cleaning methods include: roller brush cleaning, megasonic cleaning, etc. Among them, roller brush cleaning is widely used. [0003] Patent CN209551448U discloses a wafer processing device, wherein the post-processing unit includes a roller brush device. Such as figure 1 As shown, the rolling brush device includes a mounting shell, and the wafer is rotatably arranged in the mounting shell, and the rolling brush is arranged in the mountin...

AI Technical Summary

Problems solved by technology

[0004] figure 1 The rolling brush device described in has the following technical problems: when cleaning the wafer, under the centrifugal force operation, the cleaning liquid containing pollutants in the rolling brush will be thrown to the surface of the wafer, which will affect the cleaning effect of the wafer; The clean air flowing in from the upper part is transported to the bottom of the box through the gap between the roller brush and the wafer to form a protective layer on the surface of the wafer; The gap between the gaps and the air containing pollutants mix and flow to the wafer surface again, thereby weakening the protective effect of the clean air on the wafer and affecting the cleaning effect of the wafer

Specifically, when the cleaning brush rolls around its axis at a certain speed, the cleaning solution containing pollutants absorbed by the cleaning brush will be splashed to the side wall of the box under the action of centrifugal force, and the cleaning solution on the side wall will splash back to the wafer surface , thereby affecting the cleaning effect of the wafer

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