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Circuit laminated film for wafer-level packaging and sealing, its preparation method and application

A wafer-level packaging and sealing technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve the problems of unsuitable large-sized wafer-level packaging and difficult-to-embed sealed objects, so as to improve product quality, Effect of low thermal expansion coefficient and high storage modulus

Active Publication Date: 2021-03-26
WUHAN CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, at present, most of them are encapsulated by liquid epoxy resin. When the size of the sealed body is enlarged, the liquid epoxy resin will make it difficult to embed the sealed body well.
In addition, the enlarged body to be sealed also puts forward higher requirements for the fluidity and warpage of the epoxy resin composition.
The current epoxy resin packaging materials and packaging methods are not suitable for large-scale wafer-level packaging

Method used

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  • Circuit laminated film for wafer-level packaging and sealing, its preparation method and application
  • Circuit laminated film for wafer-level packaging and sealing, its preparation method and application
  • Circuit laminated film for wafer-level packaging and sealing, its preparation method and application

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Embodiment Construction

[0036] In order to make the object, technical solution and beneficial effect of the present invention more clear, the specific implementation manners of the present invention will be further described in detail below. It should be understood that the described specific embodiments are only used to explain the present invention, and are not intended to limit the present invention.

[0037] The circuit laminated film for wafer-level packaging and sealing provided by the present invention includes epoxy resin, 25-50 parts by mass of curing agent, 0.1-5 parts by mass of curing accelerator, 5-20 parts by mass of auxiliary agent, 320 The inorganic filler of ~650 mass parts, the silane coupling agent of 0.01 ~ 5 mass parts; Described epoxy resin comprises the first type epoxy resin of 40 ~ 60 mass parts and the second type epoxy resin of 15 ~ 30 mass parts , the first type of epoxy resin is one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, prefera...

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Abstract

The invention discloses a circuit laminated film for wafer-level packaging and sealing, a preparation method and an application thereof. The laminated film includes 40-60 parts by mass of a first-class epoxy resin and 15-30 parts by mass of a second-class epoxy resin , 25-50 mass parts of curing agent, 0.1-5 mass parts of curing accelerator, 5-20 mass parts of auxiliary agent, 320-650 mass parts of inorganic filler, 0.01-5 mass parts of silane coupling agent; The agent is obtained by reacting an epoxy resin with a dendritic cross-linking agent containing polyhydroxyl groups at the end. The laminated film of the present invention has good fluidity when heated and solidified, and can completely fill the gap between wafers; the packaging process using the laminated film is simple, and no matter how many wafers are used, the laminated film can be used in one process. Packaging can be done.

Description

technical field [0001] The invention belongs to the technical field of wafer-level chip packaging, and in particular relates to a circuit laminate film for wafer-level packaging and sealing, a preparation method and application thereof. Background technique [0002] With the hot sales of mobile electronic communication products such as smart phones and tablet computers, the sales of various components are driven. At the same time, as the functions of electronic communication products become more and more powerful, the requirements for light and thin, long standby time, Internet speed, and power on and off speed are also getting higher and higher, which puts higher requirements on the processor and requires more signals Pins play a greater role. Therefore, the corresponding flip-chip IC substrate and packaging technology are very important. In addition, due to the continuous advancement of the semiconductor manufacturing process, the processors of future 5G mobile communica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L63/00C08K3/36C08K5/5435C08J5/18H01L23/29H01L21/56
CPCC08J5/18H01L23/295H01L21/56C08J2363/00C08J2463/00C08K3/36C08K5/5435
Inventor 伍得廖述杭王义苏峻兴梁飞飞
Owner WUHAN CHOICE TECH CO LTD
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