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Position detection sensor and wafer box position detection device and method

A detection sensor and detection device technology, applied in the direction of measuring devices, instruments, semiconductor/solid-state device manufacturing, etc., can solve the problems that the wafer box cannot be sensed, the height of the position detection sensor cannot be adjusted, etc.

Active Publication Date: 2021-02-19
GUANGZHOU CANSEMI TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a position detection sensor, a wafer cassette position detection device and method, to solve the problem that the height of the position detection sensor cannot be adjusted in the prior art, which causes some wafer cassettes to be placed on the carrier table. The problem of being induced

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  • Position detection sensor and wafer box position detection device and method
  • Position detection sensor and wafer box position detection device and method
  • Position detection sensor and wafer box position detection device and method

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Embodiment Construction

[0042] In order to make the object, advantages and characteristics of the present invention clearer, the following combination Figure 2 to Figure 5The position detection sensor, wafer cassette position detection device and method proposed by the present invention will be further described in detail. It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention, and are not used to limit the limiting conditions for the implementation of the present invention, so they do not have technical In the substantive meaning above, any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and goals that can be achieved by the present invention. within the scope covered.

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Abstract

The invention provides a position detection sensor, a wafer box position detection device and a wafer box position detection method. The sensor comprises a triggering part and a transmitting part, thetriggering part comprises a first end part and a second end part which are connected, and the first end part can move up and down relative to the second end part; the device comprises a bearing table, a positioning pin, a controller and the position detection sensor. The method comprises the steps: installing a position detection sensor on a bearing table; adjusting the height of a trigger part of the position detection sensor according to the height of the wafer box to be detected; placing the wafer box to be detected on a bearing platform of the bearing platform; receiving a signal which issent by the position detection sensor and indicates whether the position of the wafer box is correct or not; and judging whether the position of the wafer box is correct or not according to the signal. The height of the position detection sensor can be adjusted, so that the position detection sensor can be suitable for different types of wafer boxes.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a position detection sensor, a wafer box position detection device and a method. Background technique [0002] Wafer (Wafer) refers to the silicon wafer used to make silicon semiconductor integrated circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. [0003] In the semiconductor device manufacturing process, the wafer used for manufacturing the semiconductor device needs to go through several processes before being made into the desired semiconductor device. Wafers are generally stored in a wafer box (FOUP). When the wafer undergoes various ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/00H01L21/67
CPCG01B21/00H01L21/67259
Inventor 华小伟王超
Owner GUANGZHOU CANSEMI TECH INC