Silk-screen printing silver paste and organic composition

Abstract

The invention discloses a silk-screen printing silver paste and an organic composition. The silk-screen printing silver paste comprises a metal powder, an organic carrier and a glass powder, and the organic carrier is prepared based on a polymer resin composition; and the organic composition comprises the glass powder and the organic carrier in the silk-screen printing silver paste. The silk-screen printing silver paste provided by the invention can complete a sintering process at 500 DEG C, and supports metallization requirements of conventional glass and special low-temperature sintering process requirements so that the silk-screen printing silver paste has a wider application range, and the organic composition containing the glass powder and the organic carrier in the silk-screen printing silver paste provided by the invention reaches an organic matter burning loss rate of 99.6% below the temperature of 450 DEG C, the comprehensive performance of a low glue discharging temperature,a high glue discharging speed, a low carbon residue after glue discharging and the like is achieved, and after the silk-screen printing silver paste which is formed by mixing with the metal powder isformed, the silk-screen printing silver paste and a base material can bear a strong tensile force, are not prone to being corroded by a welding flux and are good in welding performance.

Description

technical field [0001] The invention relates to the technical field of conductive materials, in particular to a screen printing silver paste and an organic composition. Background technique [0002] With the advancement of technology and changes in market demand, more and more products require metallization on the surface of substrates such as plastics, glass, ceramics and even gemstones, so that the products can achieve low resistance (generally require resistivity below 5μΩ·cm ), highly conductive properties. [0003] However, conventional low-temperature conductive materials (including conductive silver paste, conductive carbon paste, etc.) have a low content of conductive particles and poor conductivity (generally, the resistivity is above 30 μΩ·cm), and because the bonding force with the substrate depends on organic components Therefore, conventional low-temperature conductive materials usually have poor bonding force with the substrate, cannot withstand strong tensile...

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to propose a silver paste for screen printing and an organic composition, aiming at solving the problems of existing conventional low-temperature conductive materials, such as poor conductivity, inability to withstand strong pulling force, rough surface, and containing a large amount of organic matter, which lead to It cannot meet the requirements of market products, and conventional thick-film conductive materials require high sintering temperature, resulting in high energy consumption for product manufacturing and severe limitations in the overall use of materials.

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