Thermal insulation board seamless mounting structure for architectural decoration engineering

A technology for building decoration engineering and thermal insulation board, which is applied in the field of seamless installation structure of thermal insulation boards for architectural decoration engineering, can solve the problems of guaranteeing and detrimental to the indoor temperature of thermal insulation boards and falling, and achieves enhanced aesthetics, improved thermal insulation effect, and improved use long life effect

Active Publication Date: 2021-02-26
杭州万恒建设有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing device improves the connection strength between the insulation boards by strengthening the stability of the foaming agent layer, but this method still needs to rely on the foaming agent to fill the gaps of the insulation boards. Therefore, its thermal insulation effect will gradually decline, which is not conducive to the protection of the indoor temperature by the thermal insulation board. In view of this, we propose a seamless installation structure of thermal insulation boards for architectural decoration engineering

Method used

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  • Thermal insulation board seamless mounting structure for architectural decoration engineering
  • Thermal insulation board seamless mounting structure for architectural decoration engineering
  • Thermal insulation board seamless mounting structure for architectural decoration engineering

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Embodiment Construction

[0035]In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

[0036] In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0037] In the description of the present invention, it should be noted that, unless otherwise specified and limited, th...

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Abstract

The invention discloses a thermal insulation board seamless mounting structure for architectural decoration engineering, and belongs to the technical field of decoration engineering design. The thermal insulation board seamless mounting structure for architectural decoration engineering comprises a connecting board, two thermal insulation board bodies are symmetrically arranged on the two sides ofthe connecting board, two board grooves are symmetrically formed in the positions, opposite to the two thermal insulation board bodies, of the two sides of the connecting plate, two side boards are symmetrically and fixedly arranged at the upper end and the lower end of each thermal insulation board body, two inserting boards are symmetrically arranged at the two ends of each side board, inserting grooves are formed in the positions, opposite to the inserting boards, of the inner walls of the board grooves, cavities are formed in the positions, opposite to the concave positions of the outer walls of the inserting boards, of the connecting board in a hollowed mode, and connecting assemblies are arranged in the cavities. The thermal insulation effect of the thermal insulation board bodies on the indoor space can be improved, the attractiveness can further be enhanced, the mounting convenience of the thermal insulation board bodies is greatly improved, and the working efficiency is enhanced.

Description

technical field [0001] The invention relates to the technical field of decoration engineering design, and more specifically relates to a seamless installation structure of thermal insulation boards for building decoration engineering. Background technique [0002] The insulation board is made of polymer mortar, glass fiber mesh cloth, flame-retardant molded polystyrene foam board or extruded board and other materials. Generally, there will be gaps between them, and the gaps are usually filled with a foaming agent, so that the wall after installation is relatively smooth, but the defect of the foaming agent is that it is unstable. After a period of use, the foaming agent layer in the gap There may be local shedding, which will eventually affect the insulation effect of the insulation board. [0003] After searching, the patent with the publication number CN211548138U discloses a seamless installation structure of thermal insulation boards for building decoration engineering....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80E04B1/76E04B1/61E04B1/66
CPCE04B1/80E04B1/7629E04B1/6108E04B1/66
Inventor 王豪蔡丹伟蔡青新
Owner 杭州万恒建设有限公司
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