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Chip test fixture

A technology of chip testing and fixtures, which is applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of continuous injection, low efficiency of chip testing, etc., and achieve the effect of avoiding excessive temperature rise and reliable power supply

Pending Publication Date: 2021-02-26
SHENZHEN RAYBOW OPTOELECTRONICS
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application mainly provides a chip test fixture to solve the problem that the chip cannot continuously inject a test current greater than 3A during the test, resulting in low efficiency of chip testing

Method used

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0031] The terms "first", "second", and "third" in the embodiments of the present application are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "p...

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Abstract

The invention discloses a chip test fixture. The chip test fixture comprises: a heat dissipation base provided with pin holes and an accommodating cavity which are communicated with each other; an insulating part fixed in the accommodating cavity and provided with mounting holes which are communicated with the pin holes; and a power supply part fixed in the mounting holes. The heat dissipation base is used for being in contact with a heat sink of the chip, pins of the chip are electrically connected with the power supply part through the pin holes, and the power supply part is powered on to test the chip. The insulating part is arranged in the accommodating cavity of the heat dissipation base, the power supply part is arranged in the mounting holes of the insulating part, and the mountingholes are communicated with the pin holes of the heat dissipation base, so that the chip test fixture provided by the invention can supply power reliably, and the test current value of continuous injection can be improved.

Description

technical field [0001] The present application relates to the technical field of chip testing equipment, in particular to a chip testing fixture. Background technique [0002] With the application of semiconductor lasers (LD, Laser Diode) such as LD pumped solid-state lasers (DPL, Diode-Pumped Solid-State Laser), pump sources of various fiber lasers, laser cutting, welding, medical and laser military applications, etc. Increasingly, the requirements for the output power and reliability of semiconductor lasers are getting higher and higher. [0003] Semiconductor laser chips will generate a lot of waste heat during operation. For better heat dissipation, high-quality packaging technology is required to facilitate subsequent secondary designs, such as To_Can packaging, fiber coupling, etc. Semiconductor laser chips are often packaged in TO, that is, directly packaged on a heat sink with high thermal conductivity. After the semiconductor laser chip is packaged, it needs to pa...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2862
Inventor 王泰山刘文斌李成鹏蓝清锋
Owner SHENZHEN RAYBOW OPTOELECTRONICS
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