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Structure for constructing test microenvironment

A micro-environment, to-be-tested technology, applied in the field of testing, can solve the problems of large space occupation, affecting the accuracy of test results, unable to guarantee the stability of environmental parameters, etc., to achieve the effect of small structure space occupation and stable environmental parameters

Active Publication Date: 2021-02-26
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the chip reliability test method, the chip structure and performance stability under different usage environments are one of the important test items of the chip. In the current chip test, the temperature and humidity environment is mainly provided by the temperature and humidity chamber. Due to the small chip area, This kind of device not only takes up a lot of space, but also cannot guarantee the stability of environmental parameters, which affects the accuracy of test results

Method used

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  • Structure for constructing test microenvironment
  • Structure for constructing test microenvironment
  • Structure for constructing test microenvironment

Examples

Experimental program
Comparison scheme
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no. 1 example

[0031] figure 1 It is a top view of the structure for constructing the test microenvironment shown according to the first embodiment. Such as figure 1 As shown, the structure for constructing a test microenvironment in this embodiment includes a microporous matrix 1 and a first channel 11 and a second channel 12 formed inside the microporous matrix 1 .

[0032] The microporous matrix 1 is one of hydrogel, microporous molecular sieve, microporous foam, and microporous ceramics. Preferably, the microporous matrix 1 is a hydrogel, which is hydrophilic and provides suitable micropore size. Also flexible, hydrogel materials include, but are not limited to, hyaluronic acid, chitosan, polyacrylic acid, polymethacrylic acid, polyacrylamide, poly-N-polyacrylamide, and the like. Optionally, the micropore diameter of the microporous matrix 1 is 0.1 nm-1 μm, the inner diameters of the first channel 11 and the second channel 12 are 0.1 mm-5 mm, and the thickness of the microporous matrix...

no. 2 example

[0043] Figure 5 It is a top view of a structure for constructing a test microenvironment shown according to the second embodiment. Such as Figure 5 As shown, the structure for constructing a test microenvironment in this embodiment includes a microporous matrix 3 and a first channel 31 and a second channel 32 formed inside the microporous matrix 3 .

[0044] The main difference from the first embodiment is that the first channel 31 and the second channel 32 of this embodiment each include an annular portion, and the annular portion of the first channel 31 and the annular portion of the second channel 32 are arranged concentrically. The annular portions of a channel 31 and the second channel 32 are arranged alternately, that is, there is a annular portion of the second channel 32 between two adjacent annular portions of the first channel 31 .

[0045] The range of heating and humidification can be effectively limited by the annular parts of the first passage 31 and the seco...

no. 3 example

[0048] Image 6 It is a cross-sectional view of the structure for constructing the test microenvironment according to the third embodiment when it is in use. Such as Image 6 As shown, the structure for constructing the test microenvironment in this embodiment includes a shell. The difference from the first embodiment is that the microporous matrix 4 is accommodated in the shell 42, and the side of the shell 42 facing the area to be tested is open.

[0049] The side of the microporous substrate 4 facing the area to be tested is provided with a micro-protrusion structure 43, and the microporous substrate 4 contacts the surface of the chip 2 or the chip wiring pin through the micro-protrusion structure 43, while ensuring that the microporous substrate 4 and the chip 2 Or the surface of the chip wiring pin has a certain microspace, which improves the uniformity of the microenvironment.

[0050] The shell 42 can be prepared by chitosan material or organic material such as polydi...

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Abstract

The invention relates to a structure for constructing a test microenvironment. The structure comprises a microporous substrate and at least two channels formed in the microporous substrate, and the atleast two channels comprise at least two of an electric heating channel, a gas circulation channel and a liquid circulation channel. The area of the microporous substrate is matched with that of a to-be-tested area, themicroporous substrate can be supported over the to-be-tested area. The structure is small in occupied space, can provide stable environmental parameters, and is suitable for testing small devices.

Description

technical field [0001] The present application relates to the technical field of testing, in particular to a structure for building a testing microenvironment. Background technique [0002] Reliability test refers to the determination and verification of the reliability of the product through the test, and to find out the weak link of the product under the limited sample, time and use cost. It is to understand, evaluate, analyze and improve the reliability of the product. The general term for all kinds of tests. In the chip reliability test method, the chip structure and performance stability under different usage environments are one of the important test items of the chip. In the current chip test, the temperature and humidity environment is mainly provided by the temperature and humidity chamber. Due to the small chip area, This kind of device not only takes up a lot of space, but also cannot guarantee the stability of environmental parameters, which affects the accuracy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/286G01R31/2875G01R31/2881
Inventor 冯雪付浩然张柏诚唐瑞涛周涛
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG