Method for improving poor resin hole plugging of PCB

Abstract

The invention discloses a method for improving poor resin hole plugging of a PCB. The method comprises the following steps of: drilling a hole on a production board, metalizing the hole through copperdeposition and full-board electroplating in sequence, performing depth-control back drilling on the production board, performing sand blasting treatment and hole counting through a hole counting machine on the production board in sequence, and repairing the plugged hole; baking the production board, and then measuring the expansion coefficient of the baked production board; manufacturing a screenprinting plate during resin hole plugging according to the expansion and shrinkage coefficient, and enabling holes in the screen printing plate to correspond to holes to be filled with resin in the production board; filling resin ink in holes in the two surfaces of the production board in sequence through the screen printing plate in a two-surface hole plugging mode; and baking the production board to solidify the resin ink, and then removing the resin ink protruding out of the plate surface through a grinding plate. According to the method, the problem of poor hole plugging caused by hole plugging of copper slag, burrs and sundries can be avoided, the screen printing plate is manufactured according to the expansion and shrinkage coefficient of the baked production plate, and the problemof poor hole plugging caused by deviation of the screen printing plate is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving PCB resin plug hole defects. Background technique [0002] In recent years, with the development of miniaturization of assembly components, the wiring density of printed circuit boards has continued to increase. The planar density of the original shrinking aperture, line width, and line spacing tends to be a bottleneck, and increasing the three-dimensional density has become a new breakthrough. point. On this basis, many customers design via holes or blind buried holes in the connection pad. The via hole is plugged, and after curing, it is ground and leveled with an abrasive belt, and the excess resin at the hole is removed, and then copper is deposited on the surface of the plug hole, the board is electrically connected, and a circuit pattern is made. [0003] There are large and small plug holes on the circuit board, and the dia...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the existing technical defects and provide a method for improving PCB resin plug holes, which can avoid the problem of bad plug holes caused by copper slag, burrs and sundries, and can also be used to produce boards The expansion and shrinkage coefficient after baking is used to make the screen plate, which avoids the problem of bad plug holes caused by the offset of the screen plate